MultiPrep 200
Adhesion promoter that enables superior bonding for solder mask, dry film, and liquid photoresist on copper.
Contact UsProduct Overview
The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask, dry film, and liquid photoresist adhesion on copper. By eliminating pumice and brush scrubbing, MultiPrep 200 provides a uniform copper surface topography, surpassing traditional bonding consistency.
Product Features
Micro-Roughened Surface
The process delivers a micro-roughened surface excellent for soldermask adhesion to microvias and ultra-fine features, while also creating a strong, reliable bond between via fill and Plated Through Hole (PTH) copper.
Optimized Copper Surface Roughening
The enhanced bond between the soldermask coating and copper prevents adhesion loss during subsequent processes such as immersion tin plating, Hot Air Solder Levelling (HASL), and final assembly.
Excellent Compatibility
MultiPrep 200 is compatible with all final finish chemistries, including Electroless Nickel/Immersion Gold (ENIG), silver, Organic Solderability Preservative (OSP), and immersion tin finishes.
Superior Soldermask and Photoresist Adhesion
Developed from decades of expertise in copper etching, MultiPrep 200 is optimized for seamless compatibility with our many other processes. By using MultiPrep 200, you can trust that our solutions will perform reliably and consistently, earning approval across all levels of the supply chain.
Customized Micro Roughening Process
The MultiPrep 200 process eliminates the inherent issues associated with other pre-treatment methods like pumice and jet scrubbing. It delivers a rough, microetched surface ideal for microvias and ultra-fine structures on complex circuit boards. Perfect for all surface finishes, MultiPrep 200 provides ultimate uniformity and clean, continuous cosmetics.
Soldermask, Dry Film and Liquid Photoresist
Unparalleled copper adhesion to soldermask, dry film, and liquid photoresist.
Product Documentation
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