MultiBond 500
Innovative low-etch alternative oxide for improved laser direct drilling of vias and optimized topography.
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Product Overview
MultiBond 500 is a first-generation, low-etch oxide alternative designed for laser direct drill pretreatment and reliable innerlayer adhesion in multilayer circuit boards, specifically for Semi-Additive Process (SAP) and Modified Semi-Additive Process (mSAP) applications. Due to its lower etch depth and lower roughness profile, the MultiBond 500 process enhances laser direct drilling of vias while providing optimized topography to meet the most demanding adhesion requirements.
Product Features
High Uniformity
The MultiBond 500 process results in a uniform dark brown coating with finely etched copper topography, with only 0.5 µm of copper removal.
Excellent Adhesion Promotion
The resulting copper surface is ideal for laser direct drilling on thin copper foils and provides excellent adhesion to a wide range of resin systems, enhancing reliability.
Reduce Waste Treatment
The combination of low etch and high solution copper capacity results in reduced waste treatment volume.
Low-etch Oxide Alternative
The process provides a highly uniform dark oxide alternative coating for lasering. From start to finish, MultiBond 500 removes less than 1 µm of copper from the surface. Additionally, the combination of low etch and high copper solution capacity results in reduced process waste.
Enhanced Operations Savings
The MultiBond 500 process offers high bath stability, high copper stability, and long solution life, leading to reductions in consumption and waste treatment, enabling significant operational savings.
Featured Applications
mSAP and SAP
MultiBond 500 removes only 0.5 µm of copper for mSAP and SAP applications, as well as controlled impedance designs.
Product Documentation
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