M-Speed HF
Low-etch oxide alternative coating provides low surface profiles and reliable adhesion for high-frequency applications.
Contact UsProduct Overview
M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. The unique low-etch process provides a low-profile surface topography to optimize maximum signal integrity and uniform trace geometry for controlled impedance designs. The process results in a low copper roughness profile combined with a silane post-dip, enabling a low-loss, high-reliability combination of mechanical and chemical bonding.
Product Features
Exceptional Surface Topography
Excellent surface topography on all three exposed sides of the copper trace ensures that electrical properties meet the needs of high-frequency designs.
Excellent Adhesion and Thermal Resistance
Enabled by a combination of mechanical and chemical bonding, this process reduces peak-to-valley roughness on the copper surface, making it superior for fine traces.
Superior Innerlayer Bonding
The surface created by M-Speed HF offers unparalleled innerlayer bonding to a wide variety of resin systems and dielectric films.
Industry-Leading Performance
The M-Speed HF system achieves industry-leading performance by utilizing standard alternative oxide process equipment in combination with a novel post-dip process. The process is compatible with virtually all laminate materials and provides exceptional adhesion to low- and ultra-low-loss dielectric systems.
Featured Applications
High-Speed, Low Loss
Reduced copper roughness leads to reduced signal attenuation and superior reliability for high-layer-count designs.