CircuEtch 300
High-performance peroxide-sulfuric etchant system that ensures maximum circuit densities, trace profile and excellent adhesion.
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Product Overview
CircuEtch 300 is a high-performance flash etching process for circuit formation in Semi-Additive (SAP) and modified-Semi Additive Processing (mSAP) of Integrated Circuit (IC) substrates and Substrate-Like High Density Interconnect (HDI). This highly stable process precisely etches copper at the base of traces without undercut, maintaining trace shapes and adhesion to the substrate.
The high-speed etching capability is easily maintained within a wide operating window. Given the dimensions involved in substrate manufacturing, the final etch process must be extremely stable and repeatable to avoid introducing costly errors after the layer build-up process is nearly complete. The process delivers a stable etching rate across a wide operating window for primary additives, copper, sulfuric acid, and temperature.
It excels in etching a variety of copper types, including electrodeposited thin foils and electroless copper, while carefully treating electroplated pattern plates on traces to maintain critical circuit dimensions.