PC 600
Pulse plating process that delivers precise thickness uniformity and productivity unattainable by conventional acid copper plating.
Contact Us
Product Overview
PC 600 is an industry-leading pulse plating process trusted by fabricators worldwide for achieving precise thickness uniformity and productivity levels beyond the capabilities of conventional acid copper plating. It is specifically designed for the metallization of high technology panels with through hole aspect ratios approaching 30:1.
The process delivers excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power into both through holes and blind vias.