Fine Line Plating Enhancer: LDS Selectcoat 100 FL

As the applications for molded interconnect devices have expanded from simple, large antenna constructions to advanced electronic devices, conductor line sizes have become an issue due to laser debris deflection, leading to extraneous bridging during electroless deposition. Our fine line plating enhancer, Laser Direct Structured (LDS) Selectcoat 100 FL, completely solves this issue by acting as a sacrificial layer that can be removed from the part after laser direct structuring, leaving behind a pristine surface between LDS traces and allowing for compact designs with finer geometries.