Enplate® LDS NI 200

Highly stable electroless nickel process deposits a smooth, pure, dense, and uniform coating on copper plated LDS substrates.

Contact Us

Product Overview

This highly stable electroless nickel process is designed to deposit a smooth, semi-bright, adherent nickel coating. The process delivers consistent deposit brightness throughout the bath life, excellent high-temperature stability, and low electrical resistance.

Related Products

Ammoniacal Etchants

Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-gen designs.

Learn More

Innerlayer Adhesion Promotion

Ensure robust reliability for high-speed, low-loss applications with our wide range of engineered adhesion promoters.

Learn More

Leadframe Adhesion Promotion

Achieve MSL-1 performance and reliability with our adhesion promotors, from leadframe roughening to sidewall solderability enhancement.

Learn More

Molded Interconnect Device

Optimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use. 

Learn More

Process Chemicals

Achieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, from dry film adhesion to final finish.

Learn More

Solder Mask & Dry Film Adhesion

Ensure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.

 

Learn More

Related Solutions

Interconnect

We ensure robust and reliable connectivity with our advanced interconnect solutions.

Learn More