Enplate® LDS AU 301
MID specific process designed to operate at low metal concentrations, enabling lower operating costs and exceptional solderability.
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Delivering consistent selectivity on a wide variety of materials and catalysts, our final finish solutions enable more complex designs on low-cost molding composites. This easy-to-control process offers steady plating rates and predictable bath performance.
ENPLATE® LDS AU 301 is designed to operate at low metal concentrations, allowing manufacturers to reduce operating costs. Deposits exhibit exceptional solderability, contact resistance, and color uniformity.