Copper Plating: MID Copper 100
Electroless copper chemistry enables selective metallization of plastics activated through laser and 2x molding methods.
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As an industry-leading electroless copper chemistry, MID Copper 100 enables manufacturers and designers of Molded Interconnect Devices (MIDs) to selectively metallize plastics activated through laser and 2x molding methods. Our MID Copper provides unmatched yields and high plating rates from a chemical process with exceptional stability.