MultiBond™ MP

Uniquely formulated copper conversion coating for multilayer PCBs, combining micro-roughening with an embedded organic coating.

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Product Overview

MultiBond MP is a uniquely formulated copper conversion coating for multilayer Printed Circuit Boards (PCBs), combining micro-roughening with an embedded organic coating. Designed for use in high-throughput, automated horizontal conveyorized systems, it enables fast, consistent processing of thin core innerlayers. It is the ideal bonding process for controlled impedance innerlayers on advanced resin systems. With up to an 80% reduction in concentrated copper waste and low etch depth, MultiBond MP is the industry’s choice for innerlayer manufacturing.

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