Kester® K100LD Lead-Free, Alloy Bar Solder
Eutectic tin/copper alloy with controlled metallic dopants to regulate grain structure and minimize copper dissolution.
Contact UsProduct Overview
K100LD is a eutectic tin/copper alloy with controlled metallic dopants that control the grain structure within the solder joint and minimize copper dissolution into the solder pot. K100LD virtually eliminates common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints compared to traditional lead-free alloy alternatives.
Product Features
Controls the Grain Structure within the Solder Joint
K100LD is a eutectic tin/copper alloy with controlled metallic dopants that control the grain structure within the solder joint.
Minimizes Copper Dissolution
Eliminates Common Defects
K100LD virtually eliminates common defects such as icicling and bridging.