Kester® NF372-TB Soldering Flux
Zero-halogen, high-reliability, low-solids, alcohol-based no-clean wave soldering flux for standard & thick board applications.
Contact UsProduct Overview
Kester NF372-TB is a low-solids, alcohol-based flux designed for both standard and thick, high-density Printed Circuit Boards (PCBs). It is compatible with both leaded and lead-free alloys.
One of its standout features is its ability to withstand long dwell times and high preheat temperatures, which are essential in thick board assemblies. The flux maintains sustained activity, ensuring good barrel fill in challenging applications, such as reflowed copper Organic Solderability Preservative (OSP) boards or difficult-to-solder components.
Kester NF372-TB residues are minimal, clear, and non-tacky, improving cosmetics. The NF372-TB Flux-Pen® is also available for precise and controlled application.
Product Features
Zero-Halogen
Suitable for Longer Soak Times at High Preheat and Solder Pot Temperatures
Suitable for longer soak times (>5 seconds) in high preheat (>125°C) and high solder pot temperature processes.
Excellent Hole Fill Demonstrated Even on Board Thickness > 3.0mm
High Reliability Meeting the Toughest ECM/SIR IPC 004B Requirements
ROL0 per IPC J-STD-004B
High-Reliability Halogen-Free Thick-Board Flux
Kester NF372-TB is designed to withstand challenging heating profiles, outperforming standard fluxes.
NF372-TB exhibits sustained activity at elevated temperatures and long dwell times, delivering excellent hole-fill with minimal, non-tacky residue.
With a special blend of chemistries, this flux passes stringent reliability tests in various industries, even with its low-solids formulation.
Kester NF372-TB is pallet-friendly and does not attack pallet materials.
