Electrolube® LGF400 Liquid Gap Filler
A two-component, 4W/m-K cure-in-place thermal interface material formulated for demanding thermal transfer and scalable production requirements.
Contact UsProduct Overview
Electrolube® LGF400 is a thermal interface material engineered for easy processing. This silicone-based liquid gap filler features a two-component, cure-in-place formulation. With a high thermal conductivity of 4 W/m-K, LGF400 ensures superior heat transfer between mating surfaces, helping to prevent device overheating.
Thanks to its shear-thinning nature, Electrolube® LGF400 dispenses easily with precision and remains in place without slumping. Once dispensed, LGF400 conforms closely to mating surfaces, effectively filling air gaps and providing excellent wet-out. Curing can occur at room temperature or be accelerated with heat, producing a soft, fully cured elastomer that stays securely in place, preventing pump-out and ensuring long-term reliability in critical applications.
Product Features
Thermal Conductivity of 4 W/m-K for Efficient Heat Transfer
Cured Hardness: 65 Shore 00
Cures at room temperature
No risk of pump-out or dry-out during application
Available in various pack sizes
Electrolube® LGF400 Liquid Gap Filler
LGF400 is ideal for applications with medium to high thermal transfer requirements.
It is available in various package sizes, including dual cartridges, cartridge sets and bulk formats.