Electrolube^® LGF200 Liquid Gap Filler

Electrolube® LGF200 is a thermally conductive, silicone-based liquid gap filler featuring a two-component, cure-in-place formulation for easy processing. With a thermal conductivity of 2 W/m-K, it delivers excellent heat transfer between mating surfaces, helping to prevent device overheating. Its shear-thinning behavior allows for easy, precise dispensing without slumping, while the material's tackiness simplifies application.

Once dispensed, LGF200 conforms tightly to mating surfaces, effectively filling air gaps and ensuring superior wet-out. Curing can occur at room temperature or be accelerated with heat to form a soft, fully cured elastomer that stays securely in place. The result is reliable, long-term performance with no pump-out, making it ideal for demanding thermal management applications.