ALPHA® OM-377 Solder Paste
Next-Generation Solder Paste for Mobile, Wearable, and Complex Miniaturized Assemblies
Contact UsProduct Overview
ALPHA OM-377 is a lead-free, no-clean solder paste engineered for superior electrochemical reliability in fine-pitch, low-standoff SMT assemblies. Optimized for high-density PCB applications and ultra-miniaturized components down to 01005, it delivers excellent solderability, low post-reflow residue, and >1.33 Cpk transfer efficiency on fine-feature pads as small as 100 µm x 150 µm. With outstanding Head-in-Pillow (HiP) and Non-Wet Open (NWO) performance, ALPHA OM-377 is ideal for mobile, wearable, and advanced electronic assemblies requiring smaller, thinner, and lighter form factors.
Product Features
Enables Complex Miniaturized Assemblies
Superior print and reflow performance combined with ultra-fine powder technology to support complex miniaturized SMT assembly applications.
Excellent HiP and NWO Performance
Improves first-pass yield with exceptional resistance to warpage-induced Head-in-Pillow (HiP) and Non-Wet Open (NWO) defects on high I/O packages.
Robust Electrochemical Reliability
Maintains board-level electrochemical reliability on fine-pitch, low-standoff packages under stringent operating and harsh environmental conditions.
Enhanced Solderability
Enables excellent wettability and strong solder joint integrity on hard-to-wet brass and nickel surfaces.
Minimal Post-Reflow Residue
Significantly reduces post-reflow residue to help mitigate material compatibility concerns in high-density PCB assemblies.
Next-Generation Fine-Feature Printing and Reflow Capability
ALPHA OM-377 enables consistent fine-feature printing and reflow performance down to 01005 with T5 powder and 008004 and beyond with T6 powder, even under challenging area ratios and aperture designs.
Exceptional HiP and NWO Defect Mitigation
Flux chemistry specifically formulated to minimize warpage-induced Head-in-Pillow (HiP) and Non-Wet Open (NWO) defects, enabling higher first-pass yield in complex fine-pitch assemblies.
Robust Electrochemical Reliability for Long-Term Product Performance
Reliable processing on complex fine-pitch assemblies while maintaining robust electrochemical reliability. Meets latest IPC SIR and ECM standards down to 100 µm gap spacing to support long-term product performance.
