ALPHA® AccuFlux® Solder Preforms
Solder Preforms engineered to enhance reliability and heat transfer through the reduction of voids on hard-to-solder surfaces.
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ALPHA Accuflux Preforms for power electronics are an ideal solution for applications that require low voiding in large area solder joints and low flux residue.
The flux application process for these preforms is unique and guarantees that each one contains the same amount of flux within a tightly controlled range. The low flux weight required to achieve good solder wetting results in significantly reduced voiding levels.