ALPHA® HiTech® CU11-3127 Underfill
A one-component capillary underfill protects chip packages on PCBs, with high Tg and low CTE to shield solder joints from stress.
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ALPHA HiTech CU11-3127 is a high filler content product designed to provide enhanced mechanical strength for Chip Scale Packaging (CSP) and Flip Chip packages.
With its unique low-viscosity property, the material enables full coverage flow at room temperature without the need for preheating. For faster flow rates, preheating the substrate to below 80°C is recommended during the dispensing process.