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    • Circuit Board Assembly

      Driving PCB technology with leading-edge electronic materials for high-reliability in complex Circuit Board Assemblies (CBAs).
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      • Circuit Board Protection

        Safeguard electronics with advanced potting compounds and conformal coatings, ensuring durability in any environment.
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        • Conformal Coatings

          Protect your PCBAs with conformal coatings for enhanced durability and reliability in demanding environments.
        • Potting Compounds

          Protect PCBAs with potting compounds and resins that form a complete barrier, ensuring superior performance in harsh environments

        Circuit Board Protection

        Safeguard electronics with advanced potting compounds and conformal coatings, ensuring durability in any environment.

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      • Contact Lubricants

        Prolong component life, reduce wear and hot spots with proven contact lubricants, boosting electrical efficiency.

        Contact Lubricants

        Prolong component life, reduce wear and hot spots with proven contact lubricants, boosting electrical efficiency.

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      • Electronic, General Purpose Cleaning

        Deliver contaminant-free components with single-stage cleaning solutions, optimizing operation and high-performance.

        Electronic, General Purpose Cleaning

        Deliver contaminant-free components with single-stage cleaning solutions, optimizing operation and high-performance.

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      • Polymer Reinforcement

        Reinforce electrical components with high-performance adhesives, underfills and edgebonds, supporting a wide range of applications.   
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        • Adhesives & Encapsulants

          Achieve strong reinforcement for electrical components in diverse applications with our high-performance adhesives and encapsulants.
        • Edgebonds

          Improve reliability and boost manufacturing efficiency with heat-curable epoxies to reinforce advanced BGA packages.

           
        • Underfills

          Enhance reliability in complex semiconductor packages with heat-curable reinforced epoxies designed for capillary underfill.

        Polymer Reinforcement

        Reinforce electrical components with high-performance adhesives, underfills and edgebonds, supporting a wide range of applications.   

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      • Solder Recycling

        Achieve maximum returns and compliance with certified, traceable solder recycling, providing reliable waste management.

        Solder Recycling

        Achieve maximum returns and compliance with certified, traceable solder recycling, providing reliable waste management.

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      • Surface Mount Technology

        Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.

         
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        • Cored Solder Wire (SMT)

          Ensure robust performance in critical assemblies with high-reliability cored solder wire designed for primary attach and rework.

           
        • Electronic Cleaners (SMT)

          Achieve consistent, reliable cleaning results with solutions designed for a variety of assembly applications.

           
        • Preforms

          Enable reliable electronics packaging with precision preforms delivering volume control, reliability, and performance.
        • Solder Alloys

          Enable reliable electronics packaging with precision preforms delivering volume control, reliability, and performance.
        • Solder Pastes

          Meet demands for miniaturization, reliability, and yield with advanced solutions providing a wide processing window to lower TCO.
        • Stencil Solutions

          Optimize assembly with solutions addressing today’s printing needs through rapid response, high accuracy, and exceptional performance.

        Surface Mount Technology

        Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.

         

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      • Thermal Management

        Enhance device performance and longevity with high-performance materials that efficiently dissipate heat.
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        • Liquid Gap Fillers

          Advanced thermal management solutions that deliver efficient heat dissipation and long-term system reliability.
        • Thermal Pastes

          Address heat dissipation challenges with efficient heat transfer for optimal performance and reliable thermal management.

        Thermal Management

        Enhance device performance and longevity with high-performance materials that efficiently dissipate heat.

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      • Through Hole Assembly

        Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.
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        • Cored Solder Wire

          Ensure robust performance in critical assemblies with high-reliability cored solder wire designed for primary attach and rework.
        • Electronic Cleaners

          Achieve consistent, reliable cleaning results with solutions designed for a variety of assembly applications.
        • Liquid Flux

          Enhance quality and performance with high-reliability formulations for assemblies using diverse pad finishes and thicknesses.
        • Solder Alloys

          Ensure reliable PCB assembly with high-quality solder alloys that form strong, durable joints for diverse end-use applications.

        Through Hole Assembly

        Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.

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      Pioneering Solutions for Optimal PCB Assembly Performance

      We provide next-generation material solutions that enhance performance in demanding applications, enabling advanced technology, supporting high reliability, and optimizing throughput and yields for greater efficiency and value.

    • Circuitry Solutions

      Enabling next-gen technology with innovative specialty chemistries and materials for the most complex PCB and IC substrate designs.
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      • Circuit Formation

        Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-gen applications.
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        • Ammoniacal Etchants

          Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-gen designs.
        • Innerlayer Adhesion Promotion

          Ensure robust reliability for high-speed, low-loss applications with our wide range of engineered adhesion promoters.
        • Leadframe Adhesion Promotion

          Achieve MSL-1 performance and reliability with our adhesion promotors, from leadframe roughening to sidewall solderability enhancement.
        • Molded Interconnect Device

          Optimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use. 
        • Process Chemicals

          Achieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, from dry film adhesion to final finish.
        • Solder Mask & Dry Film Adhesion

          Ensure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.

           

        Circuit Formation

        Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-gen applications.

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      • Connector Plating

        Ensure durability and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.
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        • Electronic Connector Plating

          Achieve bright, matte, low-stress finishes with high-efficiency electronic plating solutions that enhance durability and reliability.
        • Precious Metal Solutions

          Get corrosion-resistant, durable finishes with our high-speed, stable precious metal plating processes for demanding applications.

        Connector Plating

        Ensure durability and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.

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      • Electrolytic Copper Metallization

        Maximize precision in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.
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        • High-Throw DC

          Create advanced mid-aspect-ratio boards with high-throw DC acid copper plating that boosts performance, reliability, and versatility.
        • Periodic Pulse Reverse

          Ensure reliable plating for thick, multi-layer PCBs with PPR solutions, offering uniform coverage of high-aspect-ratio through-holes.
        • Via Fill

          Optimize your PCB designs with high-performance copper via filling solutions, engineered to tackle any metallization challenge.

        Electrolytic Copper Metallization

        Maximize precision in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.

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      • IC Substrates

        Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.

         
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        • Acid Copper Technologies

          Enable advanced IC substrates with innovative and robust via filling, RDLs, through-hole filling, and panel-level packaging solutions.
        • Copper Adhesion Promotion

          Drive innovation with our copper adhesion promoters, delivering consistent bonding and precision etching for IC substrate excellence.
        • Final Finishes

          Meet OEM standards with high-performance finishes that enhance solderability and gold wire bonding.

           
        • Panel Level Packaging

          Portfolio of advanced solutions for enhanced uniformity, coplanarity, reliability, and precision for advanced packaging.
        • SAP Technologies

          Produce high-density Integrated Circuit (IC) substrates with our family of semi-additive, high-performance buildup processes.

        IC Substrates

        Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.

         

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      • Memory Disk

        Lay the foundation for reliable performance in complex designs with our engineered primary metallization systems.

        Memory Disk

        Lay the foundation for reliable performance in complex designs with our engineered primary metallization systems.

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      • PCB Surface Finishes

        Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.
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        • ENEPIG

          Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
        • ENIG

          Exceed IPC quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.

           
        • Immersion Silver

          Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry's most trusted ImAg finishes.
        • Immersion Tin

          Gain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
        • Organic Solderability Preservative

          Explore OEMs' preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.

        PCB Surface Finishes

        Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.

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      • Primary Metallization

        Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.
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        • Conductive Polymers

          Unlock high performance and increased board capacity with our conductive polymer-based direct metallization system.

           
        • Direct Metallization

          Achieve sustainability, cost savings, and reliability with our conductive hole-making processes that outperform traditional methods.
        • Electroless Copper

          Optimize the performance of multilayer boards with high-reliability electroless copper plating for demanding PCB applications.

        Primary Metallization

        Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.

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      High Performance Printed Circuit Board (PCB) Materials

      Our chemistries are designed to meet reliability and performance goals, addressing industry challenges for today’s electronic devices. We deliver innovative, sustainable solutions to a diverse range of markets in the rapidly evolving electronics industry.

    • Film & Smart Surface Solutions

      Functional Films & Smart Surfaces for Seamless Interfaces.  
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      • Circuit Materials

        High-performance materials designed for flexible, formable, and reliable circuits in innovative electronics applications.
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        • Flexible Electronics Inks

          Drive sustainable innovation with eco-friendly conductive, dielectric, and carbon inks for bonded flexible printed circuits (FPCs).
        • In-Mold Electronics Inks

          Enable highly reliable 3D In-Mold Electronic (IME) smart surfaces with our easy-to-use conductive, dielectric, and carbon inks.
        • Inks for Medical Sensors

          The combination of functional inks with Autostat films enables the fabrication of biosensors, and medical electrodes.

        Circuit Materials

        High-performance materials designed for flexible, formable, and reliable circuits in innovative electronics applications.

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      • First Surface Hardcoated Films for Smart Interfaces

        First Surface Hardcoated Films for Smart Interfaces 

         
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        • Hardcoated Films for 2D Interfaces

          Increase interface durability and flexibility with textured hardcoated polyester and polycarbonate films for switches and overlays.
        • Hardcoated Films for 3D Components

          Achieve seamless, high-quality finishes with hardcoated films offering deep formability, durability, and aesthetics for automobiles.

        First Surface Hardcoated Films for Smart Interfaces

        First Surface Hardcoated Films for Smart Interfaces 

         

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      • Screen Printing Materials

        Optimize stencil life and simplify prep with high-quality films, emulsions, and chemicals for superior print results every time.
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        • Screen Preparation Chemicals

          Enhance all stages of the screen print process with our mesh preparation, cleaning, and stencil reclaim chemicals.
        • Screen Printing Accessories

          Enable high-quality print reproduction with critical accessories for screen print stencil preparation.
        • Screen Printing Emulsions

          Ensure superior stencil preparation with our trusted range of screen print emulsions.
        • Screen Printing Stencil Films

          Achieve superior screen print stencils with our photosensitive stencil films, including Capillex and Fivestar.

        Screen Printing Materials

        Optimize stencil life and simplify prep with high-quality films, emulsions, and chemicals for superior print results every time.

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      A Unique Portfolio of Materials and Expertise for Smart Surfaces

      From simple labels to sophisticated automotive smart surfaces and displays, our flexible films, formable films, and circuit inks enable efficient design and high-yield production of durable, attractive Human Machine Interfaces (HMIs).

    • Semiconductor Assembly

      Advancing innovative electronics with reliable bondline materials for electronics, photomasks, die attach, packaging and camera modules.
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      • Advanced Interconnect Assembly

        Enhance thermal efficiency and precision with our solder TIM, solder, and flux solutions for advanced chip fabrication.
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        • Interconnect Solder Paste

          Advanced solder solutions for interconnecting semiconductor packages, from laminate to leadframe packaging.
        • Semiconductor Solder Flux

          Our Semiconductor fluxes for CSP, flip chip, and BGA ball attach deliver high yields, stable performance, and easy DI water cleanup. 
        • Solder Thermal Interface Material

          Optimize heat management with our Solder Thermal Interface Materials (TIMs).

        Advanced Interconnect Assembly

        Enhance thermal efficiency and precision with our solder TIM, solder, and flux solutions for advanced chip fabrication.

        Learn more
      • Camera Modules

        Camera module adhesives for secure assembly and peak performance.
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        • Adhesives - Camera Modules

          Ensure durable camera module assembly.

        Camera Modules

        Camera module adhesives for secure assembly and peak performance.

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      • Microelectronics and Sensors

        Optimize electronics performance with getters and marking inks for superior bonding and chemical resistance improving device lifespan.
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        • Getters

          Enhance reliability and performance of hermetic packages.
        • Marking Inks

          Ensure long-lasting identification with durable, high-quality marking inks.
        • Thermoplastic Adhesives

          Achieve reliable bonds with flexible thermoplastic adhesives.
        • Thermoset Adhesives

          Secure strong bonds for durable performance.

        Microelectronics and Sensors

        Optimize electronics performance with getters and marking inks for superior bonding and chemical resistance improving device lifespan.

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      • Photomasks

        Maximize yield and reduce cost of ownership with reliable Compugraphics photomasks delivered with fast cycle times.

        Photomasks

        Maximize yield and reduce cost of ownership with reliable Compugraphics photomasks delivered with fast cycle times.

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      • Power Electronics

        Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.
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        • Die Attach - Sinter

          Ensure reliable bonds with advanced sintering materials.
        • Package Attach - Sinter

          Ensure long-lasting bonds with advanced sintering materials.
        • Power Electronics Preforms

          Achieve precision with reliable solder preforms for power electronics.
        • Top Attach - Sinter

          Secure reliable bonds with advanced sintering materials.

        Power Electronics

        Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.

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      • Standard Die Attach

        Attain high-precision, reliable bonding with our die attach solutions for advanced semiconductor assembly.
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        • Conductive

          Enhance Performance with ATROX® Conductive Materials
        • Hybrid Sintering

          Boost Reliability with ATROX Hybrid Sintering

        Standard Die Attach

        Attain high-precision, reliable bonding with our die attach solutions for advanced semiconductor assembly.

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      Engineered Thermal Management Solutions

      Top-side, die attach, and package attach for power electronics. High-, mid-, low-thermal, non-conductive die attach materials, flip chip & BGA fluxes, fine-feature solder paste, and sTIM.

    • Wafer Level Packaging

      Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.
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      • Advanced Interconnect Metallization

        Transform package performance with advanced interconnect solutions, delivering reliable, uniform, and robust results.
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        • Damascene

          Enable advanced-node manufacturing with dual-damascene processes for bottom-up copper electroplating and void-free metallization.
        • Hybrid Bonding

          Optimize pitch reduction, power efficiency, and reliability in advanced interconnect applications with our hybrid bonding solutions.
        • Low Alpha Materials

          Enhance reliability in next-generation devices with our high-quality, sustainably sourced low-alpha tin materials.
        • Redistribution Layer (RDL)

          Unlock best-in-class RDL performance with our RDL solutions, enabling efficient I/O pitch redistribution and advanced plating precision.
        • Through-Silicon Via (TSV)

          Fill TSVs efficiently with our copper plating process, delivering reliable bottom-up plating for complex, high-density packages.
        • Wafer Bumping

          Enhance reliability and performance in next-generation semiconductor packages with advanced wafer bumping metallization solutions.

        Advanced Interconnect Metallization

        Transform package performance with advanced interconnect solutions, delivering reliable, uniform, and robust results.

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      • Compound Semiconductor Fabrication

        Enhance reliability and performance in compound semiconductor fabrication with industry-leading precious metal plating technologies.
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        • Backside Metallization

          Optimize via step coverage, yield, and reliability for power/RF with our solutions that integrate seamlessly with die attach material.
        • Display Driver Interface (DDI)

          Achieve superior bondability, reliability and thermal stability of display driver applications with our high-hardness gold solutions.
        • FOWLP Solder Surfaces

          Design next-generation Fan-Out Wafer Level Packaging (FOWLP) with our advanced gold and palladium solutions for thin metal films.
        • Gold Etch Materials

          Ensure precise, uniform gold seed removal on TiW barriers with advanced, cost-effective gold etchants for semiconductor fabrication.
        • Micro-Electromechanical Systems (MEMS)

          Enable high plating rates and superior step coverage with our advanced, cost-effective solutions for MEMS fabrication.
        • Redistribution Layer for WLP

          Enhance solderability and conductivity with high-purity deposits, seed filling, and adjustable roughness for advanced semiconductors.

        Compound Semiconductor Fabrication

        Enhance reliability and performance in compound semiconductor fabrication with industry-leading precious metal plating technologies.

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      Advanced Packaging Solutions

      Our materials maximize semiconductor performance and reliability for next-generation technologies. With an agile and flexible development process, we deliver unique solutions that provide the lowest cost of ownership and the fastest time to market.

    CS_Leaders in Primary Metallization image

    Boosting PCB, IC substrate, semiconductor & display performance.

    We are the market leader of innovative, integrated specialty chemicals and material technologies which shape the future of circuitry, semiconductors, board assembly, and smart surfaces; improving performance and reliability of electronics products.

  • Solutions & Sustainability
    • Interconnect

      Our Interconnect Solutions

      Our metallization and wafer level packaging technologies enable complex, high-density interconnect designs. We provide advanced solutions for direct metallization of printed circuit boards, semi-additive copper metallization on IC substrates, and copper plating for TSV interconnects.  

      When applied in wafer-level packaging, PCB fabrication, and semiconductor assembly, our solutions deliver seamless electrical performance and long-term reliability, reinforcing our commitment to innovation and excellence in connectivity.

    • Connect

      Our Connect Solutions

      We enable reliable circuit pathways that enhance connectivity in high-density designs. Our board-level assembly, circuit fabrication, standard die attach, top-side attach, and package attach solutions create strong, durable bonds with excellent electrical and thermal conductivity for advanced performance.

    • Reinforce

      Our Reinforce Solutions

      Our precision bonding technologies reinforce critical components with advanced mechanical and adhesive properties, ensuring reliability and optimal performance in next-generation electronics, even in the harshest of environments.

    • Protect

      Our Protect Solutions

      Formulated to withstand physical shock, vibration, corrosion, and thermal stress, our protective solutions extend component lifespan and reduce risk of failure.

      When used in circuit board assembly, our technologies deliver durable protection and consistent performance, reinforcing our commitment to enhanced device reliability.

    • Thermal Management

      Our Thermal Management Solutions

      We offer a wide range of thermal interface material (TIM) solutions for circuit board and semiconductor assembly in high-powered electronics, delivering superior thermal performance without compromising device miniaturization or system complexity.  

      Our combined solutions ensure optimal thermal regulation, reinforcing our expertise in maintaining device efficiency and reliability.

    • Haptics & Touch

      Our Haptic & Touch Solutions

      Our formable and flexible films, combined with advanced circuit materials, enable innovative designs and high-yield production of durable, visually striking Human Machine Interfaces (HMIs). 

      We create immersive, responsive user experiences that reinforce our leadership in advanced haptic solutions for next-generation devices.

    CBA_Conformal Coating

    Solutions at Every Step

    Our electronic solutions support every stage of manufacturing, from wafer fabrication to final assembly, complemented by smart surface films and in-mold electronics solutions. 

  • Brands
    • AccuFlux®

      AccuFlux®

      Precision micro-flux coatings reduce voids, enhance joint integrity, and set new standards for soldering performance.

    • ActiveCopper™

      ActiveCopper™

      Tunable copper sintering pastes, adhesives, and inks for die attach, micro-bumping, and via fill—delivering superior heat transfer.

    • Affinity™

      Affinity™

      ENIG and ENEPIG final finishes for reliable wire bonding and superior solderability in advanced packaging designs.

    • ALPHA®

      ALPHA®

      Advanced adhesion, flux, and soldering solutions for reliable electronic assemblies in lead-free and tin-lead technologies.

    • Argomax®

      Argomax®

      Reliable sinter and die-attach solutions for EV and power electronics, meeting rigorous industry standards.

    • ATROX®

      ATROX®

      High-performance conductive and non-conductive die-attach pastes and films for power semiconductors and discrete assemblies.

    • Autostat™

      Autostat™

      A low shrink, heat stabilized polyester film with excellent ink adhesion, enabling reliable, high precision flexible circuits & sensors.

    • Autotype®

      Autotype®

      Autotype® delivers premium hardcoated films and screen making products rooted in innovation, quality, and heritage.

    • Blackhole®

      Blackhole®

      The efficient, reliable PCB metallization solution preferred by fabricators worldwide over electroless copper.

    • Compugraphics®

      Compugraphics®

      Delivering reliable, high-precision photomask solutions that ensure quality, speed, and flexibility to meet your manufacturing needs.

    • Eclipse®

      Eclipse®

      Easy-to-use, efficient PCB metallization that delivers high performance, reliability, and durability.

    • Electrolube®

      Electrolube®

      Advanced conformal coatings, encapsulation resins, and thermal management solutions for reliable electronics manufacturing.

    • Enklad

      Enklad

      Advanced cleaning, etching, and zincate processes for superior nickel coatings on aluminum memory disks.

    • ENTEK®

      ENTEK®

      Trusted organic solderability preservatives, proven in production across diverse lead-free assembly applications.

    • ENVISION®

      ENVISION®

      Polymer-based direct metallization for PCBs enhances board capacity and performance.

    • Exactalloy®

      Exactalloy®

      Precision solder preforms ensure accurate volumes, improving reliability and efficiency in electronics assembly.

    • HiFlo®

      HiFlo®

      Purest, high-fluidity solder made from virgin metals for unmatched performance and minimal dross.

    • HiTech®

      HiTech®

      Drop Shock, Impact Bend, and ATC-tested adhesives, underfills, and encapsulants for soldered components.

    • Innolot®

      Innolot®

      High-reliability, lead-free solder alloy for robust performance in harsh environments.

    • Kester®

      Kester®

      Circuit board assembly materials including traditional soldering chemicals, paste, wire, and bar products. 

    • Kuprion®

      Kuprion®

      Engineered copper innovations for high-power electronics.

    • M-Copper Omega®

      M-Copper Omega®

      Premium electroless copper for primary PCB metallization, ensuring high reliability.

    • MacuSpec™

      MacuSpec™

      High-performance electrolytic copper processes for the plating of through holes and filling of micro vias.

    • MICROFAB®

      MICROFAB®

      High-quality copper, gold, and solder for WLP, meeting demands of IDM, OSAT, and foundries.

    • Micromax™

      Micromax™

      Micromaxtm Electronic Inks and Pastes are highly reliable thick film inks, pastes, ceramic tapes and printed electronic inks.

    • MultiPrep

      MultiPrep

      Advanced copper treatment, promoting adhesion for innerlayer and soldermask applications.

    • NOVAFAB®

      NOVAFAB®

      Advanced Cu, Ni, Pd, Ag, and Au solutions for WLP, meeting the demands of IDM, OSAT, and foundries.

    • ORMECON®

      ORMECON®

      Extremely stable immersion tin process with exceptional solderability, even after multiple lead-free assembly reflows.

    • PALLADEX®

      PALLADEX®

      Electrolytic palladium plating for reliable connectors and interconnects.

    • PowerBond®

      PowerBond®

      High-strength solder with superior thermal fatigue, close to high-lead alloy performance.

    • Reliance®

      Reliance®

      A unique, patent-pending reliability toolset integrating solder and polymer data insights for unmatched circuit board assembly perform

    • Shadow®

      Shadow®

      Sustainable graphite-based direct metallization, a cleaner alternative to electroless copper.

    • STAYDRY®

      STAYDRY®

      Advanced moisture, particle, and hydrogen getters designed to enhance performance and reliability across diverse applications.

    • STAYSTIK®

      STAYSTIK®

      Versatile adhesives delivering reliable mechanical, electrical, and thermal bonding for both temporary and permanent applications.

    • Sterling®

      Sterling®

      Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility.

    • Systek™

      Systek™

      Comprehensive IC substrate metallization processes for RDL, through-hole filling, and embedded traces.

    • TensoRed®

      TensoRed®

      Reliable, cost-efficient stencil tensioning that ensures consistent performance without the need for air pressure.

    • Tetrabond®

      Tetrabond®

      Innovative "frameless" stencils for safer, more secure mounting and demounting.

    • TrueHeight®

      TrueHeight®

      Preforms that ensure consistent bondline thickness, reducing die tilt in assembly.

    • Via Dep®

      Via Dep®

      Low-stress electroless copper for PTH and micro-via metallization, with reliable, horizontal processing.

    • ViaForm®

      ViaForm®

      Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication.

    • XMAPP™

      XMAPP™

      Comprehensive guidance and expertise with XtraForm® materials, process mapping, product design, and production processes.

    • XtraForm®

      XtraForm®

      High-performance hardcoated, formable 3D films for durable, seamless integration of electronics in automotive surfaces.

  • Markets
    • Automotive Electronics

      Electronics Solutions for Next-Generation Automotive Reliability

      High-performance materials engineered for reliability in extreme conditions. Our solutions connect, protect, interconnect, and reinforce circuitry in powertrain, in-cabin, lighting, and safety system automotive electronics assemblies.

    • Computing

      Enhancing Production Yields While Reducing Total Cost of Ownership

      We engineer soldering materials, reinforcement polymers, and circuitry formation solutions to increase throughput, reduce costs, and deliver reliable connections across all types of computer-related assemblies.

    • Consumer Electronics

      Boost Throughput with Low-Cost, Low-Temp Solder Solutions

      For consumer electronics PCB assembly and semiconductor manufacturing, our integrated products, expertise, and innovative processes enable designers to miniaturize components, enhance performance, and reduce the total cost of ownership.

    • Industrial / HMI

      PCB Assembly Materials & Hardcoated Films for HMI Touchscreens

      In addition to providing connectivity and heat dissipation between components, our materials protect PCBs and enhance touchscreen strength. Our high-performance solder alloys also resist damp environments, all contributing to extended component life.

    • Medical Solutions

      Improving Component Reliability and Manufacturing Efficiency

      We improve the reliability of medical components and assemblies while reducing costs and enhancing manufacturing efficiency. Our electronics solutions for the medical industry meet performance specifications and support device-level FDA approval.

    • Military & Aerospace

      Performance and Reliability, Even in Demanding Environments

      Our circuitry formation, board, and semiconductor assembly products ensure reliability in electronic solutions for military and aerospace applications. Trusted by PCB fabricators, they deliver robust performance even in the harshest environments.

    • Mobile Phone

      Integrated Solutions for Smartphone Design and Assembly

      Our electronic solutions for mobile phone assembly cover wafer-level packaging, circuit metallization, semiconductor, and board assembly, helping companies build the most complex components used in advanced smartphone devices today.

    • Power Electronics

      Improving the Power, Range and Reliability of Power Electronics

      Sinter materials, high-reliability solder, reinforcement polymers, and thermal interface materials reduce thermal resistance, protect in harsh environments, and dissipate excess heat, significantly improving efficiency and performance.

    • Renewable Energy

      Electronic Materials for Green Energy Electronic Solutions

      Our connecting and interconnecting materials enable green energy electronics, including module assemblies, microinverters, and PV ribbon and wire manufacturing, enhancing efficiency and performance, even in high-voltage applications.

    • Telecommunications

      Flexible Hardware Design Options

      We engineer integrated solutions that offer high electrochemical reliability, excellent thermal and electrical conductivity, high throughput, and low defects—ensuring superior performance and efficiency in your telecommunications electronic service hardware.

    LAM-688x529_0

    Markets

    We deliver unmatched reliability and performance across diverse electronic markets with integrated materials that connect, interconnect, reinforce, protect, manage heat, and enhance haptics and touch capabilities.

  • About Us
    • Careers
      macdermid what are we looking for

      Come Join MacDermid Alpha!

      Join an organization with over 100 years of innovation and a culture built on character and collaboration. We have created a work environment where you can truly thrive. 

    • Search Jobs
    CS_Hero-Circuitry Solutions

    About MacDermid Alpha Electronics Solutions

    MacDermid Alpha Electronics Solutions, a business unit of Element Solutions Inc, holds a distinguished position as a global leader in the field of fully integrated materials, helping to deliver enhanced performance, reliability, and sustainability to electronics manufacturers worldwide.

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