News & Events

Alpha Assembly Solutions (MacDermid Alpha), Heraeus, and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH, and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju’s infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.

MacDermid Alpha Electronics Solutions, a leading global provider of advanced chemistries and material solutions for the electronics industry, is proud to announce its participation at IPC APEX 2024, held April 9-11, at the Anaheim Convention Center in Anaheim, CA. 

MacDermid Alpha Electronics Solutions, a global leader in innovative electronic materials, is proud to announce its participation in Productronica China 2024, taking place from March 20-22 at the Shanghai New International Exhibition Center (SNIEC) in Shanghai.

Supply chain management plays a crucial role in meeting the demand for printed circuit boards (PCBs) in today’s global electronics marketplace. Many complex logistical issues must be considered when developing a robust supply chain strategy. From labor costs and lead times to geopolitical tensions and environmental impacts, the challenges are numerous.

Leveraging change as a catalyst to enhance profitability in the printed circuit board (PCB) fabrication industry is both a strategic imperative and a promising opportunity. In an era of rapid technological evolution and shifting market dynamics, embracing change is not just a choice; it is a necessity. By continually adapting to new manufacturing technologies, materials, and design methodologies, PCB fabrication companies not only stay competitive but also drive increased profitability.

Traditional PCB fabrication leaves a toxic legacy in its wake, but a revolution is underway. There are eco-friendly alternatives reshaping the electronics industry and paving the way for a cleaner, greener future.

In the manufacture of advanced electronics, high-speed signal requirements are becoming common. As a result, printed circuit board (PCB) manufacturers, IC Substrate fabricators, and original equipment manufacturers (OEMs) are looking for solutions to enable them to build and design circuit boards that transmit at higher signal speeds than previously possible with standard manufacturing processes.

MacDermid Alpha Electronics Solutions celebrated the highly anticipated grand opening of its China Electronics Applications Center (CEAC) on June 2, 2023, in Pudong New Area, Shanghai. The center’s state-of-the-art capabilities encompass a wide range of services, including the rapid development of prototypes, precise reliability testing, and the exploration of ground-breaking application techniques.

MacDermid Alpha, will present its latest research on high-speed copper plating at the 19th Annual Device Packaging Conference (DPC 2023), held March 13-16, at the We-Ko-Pa Conference Center in Fountain Hills, Arizona. Engage the industry experts at booth 31-32, where MacDermid Alpha will showcase the performance benefits of advanced materials for die attach, chip fabrication, and wafer-level packaging.

As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next-generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.

MacDermid Alpha will exhibit its latest interconnect solutions and present five papers at the SMTA International Expo and Conference taking place October 31 – November 3 at the Minneapolis Convention Center in Minneapolis, MN.

MacDermid Alpha Electronics Solutions, announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications.