Thailand Electronics Circuit Asia 2024

Bangkok International Trade & Exhibition Centre

Trade Show
MacDermid Alpha will highlight its advanced solutions for complex PCB (Printed Circuit Board) designs including direct metallization technology, as well as its unsurpassed global supply chain expertise and technical support at the Thailand Electronics Circuit Asia show. Our specialized technology innovations will be showcased at booth #B20.

Meet our technical experts at our booth to discover our technology solutions that address challenges and opportunities from high speed innerlayers on board materials to circuit density improvements, as well as high performing surface finishes. Learn how our range of precise, reliable, and high-performance solutions combined with our deep expertise throughout the electronics supply chain makes MacDermid Alpha the solutions supplier of choice for PCB manufacturers looking to implement supply chain diversification as part of the China Plus One strategy.

Hear From Our Technical Experts:

MacDermid Alpha’s technology experts will present three papers during the event focused on the latest solutions designed to provide enhanced reliability for high-density designs and ensure the highest levels of PCB fabrication quality.

Enhance Reliability for High-Density Designs:

Carmichael Gugliotti, Product Manager for Primary Metallization, will analyze the relationship between the direct metallization and electrolytic copper processes, looking at how the two processes can be optimized to maximize performance and reliability in the paper ‘A Comprehensive Study of the Interaction Between Direct Metallization and Electrolytic Copper’ on July 24, from 13:15 to 14:00.

Ensure High PCB Fabrication Quality:

Frank Xu, Global Product Manager – Final Finishes, will present solutions for fabricators facing new challenges with the introduction of IPC 4552 B for ENIG finished printed circuit boards. Discover more in his presentation, ‘Achieving a Successful ENIG Finished PCB Under Revision A of IPC 4552’, on July 25, from 13:15 to 14:00.

Increase Signal Frequency and Data Rates:

Bruce Lee, Technology Manager – Electronics Packaging, will discuss the changes that inner-layer adhesion promoters such as oxides and “oxide alternatives” have undergone in recent years in response to ever increasing signal frequencies and data rates, thermal reliability, and reduced copper removal. Learn more in the presentation, ‘Technology Road Map to Oxide replacement’ on July 26 from 13.15 to 14:00.
The Thailand Electronics Circuit Asia show is Thailand’s premier event for the printed circuit board industry focused on the latest technology trends and advancements and exploring opportunities for developing PCB and PCBA expertise within the ASEAN industry.

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