Leading Low Temperature Solutions

PRODUCT NAME DESCRIPTION KEY FEATURE
ALPHA OM-565 HRL3 Enables 175 °C peak reflow temperature to enhance mechanical reliability while improving energy efficiency of the assembly process. 
  • Superior Non-Wet-Open and Head-in-Pillow performance
  • Enhanced mechanical reliability 
  • Compatible with contact rework applications

ALPHA OM-550

Designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys.
  • Fine Feature Capable (≥T5 powder type)
  • Post-reflow residue containment
  • Low Head in Pillow & Non-Wet Open
ALPHA CVP-520 Enables low temperature SMT assembly technology to minimize rework in multiple reflow applications.
  • Fine Feature Capable (≥T5 powder type)
  • Ultra Low Voiding
  • Wide reflow process window

 

Our low-temperature soldering (LTS) solutions have revolutionized high volume applications, including conversion from Wave to SMT and from SAC alloys to Low Temperature SMT

ALPHA Exactalloy Tape and Reel Preforms

Our low-temperature soldering (LTS) solutions have revolutionized high volume applications, including conversion from Wave to SMT and from SAC alloys to Low Temperature SMT

ALPHA Exactalloy Tape and Reel Preforms

Our portfolio of solder pastes are available in a variety of low temperature alloys and powder sizes to support printing, dispensing, and jetting application methods.  Low temperature adhesives for underfill, edgebond, and camera modules are also available.

Printing Dispensing / Jetting Gluing, Underfilling and Edgebonding

Our portfolio of solder pastes are available in a variety of low temperature alloys and powder sizes to support printing, dispensing, and jetting application methods.  Low temperature adhesives for underfill, edgebond, and camera modules are also available.

Printing Dispensing / Jetting Gluing, Underfilling and Edgebonding

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solid Solders Low Temperature Adhesives

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solid Solders Low Temperature Adhesives

Our low-temperature soldering (LTS) solutions have revolutionized high volume applications, including conversion from Wave to SMT and from SAC alloys to Low Temperature SMT

ALPHA Exactalloy Tape and Reel Preforms

Our low-temperature soldering (LTS) solutions have revolutionized high volume applications, including conversion from Wave to SMT and from SAC alloys to Low Temperature SMT

ALPHA Exactalloy Tape and Reel Preforms

Our portfolio of solder pastes are available in a variety of low temperature alloys and powder sizes to support printing, dispensing, and jetting application methods.  Low temperature adhesives for underfill, edgebond, and camera modules are also available.

Printing Dispensing / Jetting Gluing, Underfilling and Edgebonding

Our portfolio of solder pastes are available in a variety of low temperature alloys and powder sizes to support printing, dispensing, and jetting application methods.  Low temperature adhesives for underfill, edgebond, and camera modules are also available.

Printing Dispensing / Jetting Gluing, Underfilling and Edgebonding

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solid Solders Low Temperature Adhesives

Many circuit board assemblers have found that low temperature solders offer substantial process, reliability and sustainability benefits by enabling lower peak reflow temperatures.

Low Temperature Solid Solders Low Temperature Adhesives
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