Product Overview

ALPHA OM-5300 is a zero halogen, no clean solder paste developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly.  ALPHA OM-5300 provides excellent print volume repeatability and minimizes print cycle time by enabling high print speeds and extended number of prints between stencil undercleaning.

ALPHA OM-5300 is capable of withstanding long, hot soak reflow profiles, allowing better wetting of lead free surfaces with tin lead paste alloy. Excellent BGA voiding and high post reflow SIR performance makes ALPHA OM-5300 ideal for tin lead soldering when lead free components are used.

 

 

Product Features

  • Fine feature Capability - High print deposit volume & low volume variability to 12mil
  • Excellent response to pause performance, generating fewer defects
  • Class III BGA voiding resistance even when SAC 305 BGA spheres are used
  • Applicable with high volume PiP assemblies
Technical Bulletins
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Documentation icon - Technical Bulletin

ALPHA OM-5300 Solder Paste Technical Bulletin English

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Documentation icon - Technical Bulletin

ALPHA OM-5300 锡膏 技术公告 简体中文

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Images of ALPHA OM-5300 Print Consistency

Wide print speed capability allows for maximum throughput

Excellent transfer efficiency and low variability based on theoretical aperture volumes. Faster print speed reduces print cycle time, allowing printers to perform secondary functions without  affecting SMT line beat rate.

Consistent print speed and transfer efficiency is shown on 0.300mm pitch rectangular QFP pads up to 150mm/s for maximum throughput.

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