Search
Product Overview
Kester 979's finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. Kester 979 also reduces micro solder balling on glossy laminates and between connector pins.
This flux leaves a minimal amount of residue after soldering. All remaining residues are non-corrosive, non-conductive and do not need to be removed.
Product Features
- Halide-free
- VOC-free for lower VOC emissions
- Exceptional wetting for excellent hole-fill, even with prior reflows
- Thermally stable activators provide low solder bridging and solder balling
- Minimal residue and no offensive odor
- High reliability meeting the ECM/SIR IPC 004B requirements
- ORL0 per IPC J-STD-004
High Performing VOC-free Flux
Kester 979 is a halide-free, ORL0, VOC-free flux for lower VOC emissions.
This flux has a low solids content which prevents clogging or buildup around flux spray nozzles.
Related Products
- VOC-Free, Halide-Free
- No-Clean, Low Residue
- Wide Process Window
|
Product Type |
Product Name |
VOC-Free |
Halide Free |
Low Residue |
Best Used Assembly Type |
|---|---|---|---|---|---|
|
Liquid Flux |
YES |
YES |
**** |
II, III |
|
|
Liquid Flux |
YES |
YES |
**** |
II, III |
|
|
Rework Flux |
No |
YES |
***** |
I, II, III |
|
|
Rework Flux |
No |
YES |
***** |
I, II, III |
|
| Cored Wire | ALPHA Telecore HF-850 | No | YES | N/A | N/A |
| Cored Wire | Kester 268 | No | YES | N/A | N/A |
Let our experts find your solution.