News & Events

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MacdermidAlpha-Market
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SMTA Huntsville
Assembly, Circuitry, Semiconductor
Press Release
New Low Temperature Solder Paste to be featured at SMTA Huntsville Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.
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Ravi Bhatkal presents to India industry association
Assembly
News
Ravi Bhatkal presents to The Centre for Nano Science and Engineering (CeNSE)
Ravi Bhatkal, Managing Director - India, presented to The Centre for Nano Science and Engineering (CeNSE) on Advanced Materials in Electronics Manufacturing.
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Image of Paul Salerno interview with EMS Now on Low Temp Solders
Assembly
Multimedia
Watch interview with Paul Salerno discussing applications & advantages of low temperature solders
Watch interview with EMSNOW - Up Close With Paul Salerno on applications and advantages of low temperature solder.
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Image of flexible electronics for LOPEC Paper promotion
Assembly, Circuitry, Semiconductor
Press Release
Technical Presentation on High Reliability Materials for 3D Structural Electronics at LOPEC 2022 Exhibition and Conference
MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.
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ALPHA OM-565 HRL3 Solder Paste
Assembly
Press Release
Product Launch - ALPHA® OM-565 HRL3, Next Generation, Low Temperature Solder Paste
MacDermid Alpha Electronics Solutions, announces the launch of ALPHA OM-565 HRL3, next generation, high reliability low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages.
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Solder Joint Ruggedness graphic images of drop shock, high stress
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha to feature enhanced reliability solder pastes at SMTA Rocky Mountain & Dallas Expos
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.
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CircuEtch 300
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Releases CircuEtch 300 Anisotropic Final Etch for SAP and mSAP
MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
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APEC Paper
Assembly
Press Release
MacDermid Alpha Presents Sinter Technology Technical Paper at APEC Power Electronics Conference 2022
(Waterbury, CT USA) – February 14, 2022 - The Power Electronics Division of MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Automotive Traction Module Attach by Silver Sintering – Process, Performance, and Reliability” at the APEC 2022 Power Conference taking place from March 20-24, 2022 in Houston, Texas.
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imaps
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha to Exhibit and Present at the IMAPS Device Packaging Conference
MacDermid Alpha Electronics Solutions, will be exhibiting and presenting a paper at the IMAPS Device Packaging Conference at the WeKoPa Resort and Conference Center, Fountain Hills, AZ, March 7-10, 2022.
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Karl Pfluke
Assembly
Press Release
MacDermid Alpha Electronic Solutions Announces New District Sales Manager for Southeast United States Region
MacDermid Alpha Electronics Solutions, announces the appointment of Karl Pfluke as District Sales Manager of the Southeast supporting the Alpha and Kester Assembly brands.
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Beth Turner
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha’s Electrolube Awarded NextGen Best Paper
MacDermid Alpha Electronics Solutions, is pleased to announce that Electrolube’s Senior Technical Manager, Beth Turner, has been awarded NextGen Best Paper. The paper, entitled “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment”, was selected by the IPC Technical Program Committee for its thought-provoking, well-researched analysis of bio-based chemicals that led to the development of Electrolube’s breakthrough bio-resins range.
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Peter Sarmanian Award
Assembly, Circuitry, Semiconductor
Press Release
IPC Honors MacDermid Alpha Electronic Solutions with Corporate Recognition Awards
IPC presented its highest corporate honors during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2022. The Peter Sarmanian Corporate Recognition Award was presented to MacDermid Alpha Electronics Solutions.
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