IMAPS Device Packaging Conference & Expo 2023
WE-KO-PA RESORT & CONFERENCE CENTER
Discover solutions for advanced interconnect metallization and assembly materials used in leading-edge chip fabrication and wafer-level packaging. MacDermid Alpha supplies leading-edge technologies that enable the highest end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry. Booth 31-32
The 19th Annual Device Packaging Conference (DPC 2023) will be held at the WeKoPa Resort and Conference Center, from March 13-16, 2023, and organized by the International Microelectronics Assembly and Packaging Society (IMAPS). MacDermid Alpha will be promoting its latest solutions from its full line of innovative and high-quality plating, soldering, and assembly at booth 31-32.