MacDermid Alpha Presents Technical Paper at SMTA Penang Chapter
Waterbury, CT USA) – September 14, 2022 - The Assembly division of MacDermid Alpha Electronics Solutions will present the technical paper 'Edge Bonding as Viable Reinforcement for Solder Joints in High Reliability Applications' at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
The paper will explore the feasibility of the edge bonding process to further strengthen assembled BGA packages with high reliability solder joints. This ability can improve the thermal fatigue resistance of these assembled packages. Experimental data will be presented for validation of this reinforcement capability.
MacDermid Alpha's range of ALPHA HiTech Edgebond products are one component, heat curable epoxies, designed to be dispensed on the corners of the BGA. The cured Edgebond helps to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).
Jimmy Shu, Product Manager - Adhesives and Encapsulants, Circuit Board Assembly at MacDermid Alpha, will present the paper at 2:00pm on Wednesday, September 21st in Eastin Hotel Penang.
SMTA Penang Chapter Expo & Technical Forum 2022
Topic: Edge Bonding as Viable Reinforcement for Solder Joints in High Reliability Applications
Speaker: Jimmy Shu, Product Manager
Date/Time: September 21st (Weds)/ 14:00-14:30
Venue: Level 3, Grand Ballroom, Eastin Hotel Penang