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Assembly, Semiconductor
Press Release
Protection Solutions for Advanced Battery Performance to be Showcased at The Battery Show North America
MacDermid Alpha has announced that its electro-chemicals brand, Electrolube, will be exhibiting at the Battery Show North America on booth #1211 at the Suburban Collection Showplace, Novi, Michigan on the 13th-15th September.
Assembly, Circuitry, Semiconductor
Press Release
Product launch of ALPHA HRL3 Solder Sphere
MacDermid Alpha Electronics Solutions, announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications.
Assembly, Semiconductor
Press Release
MacDermid Alpha to Promote New ALPHA® Argomax® AccuLam™ Sintering Film and Package Attach Sintering Application at PCIM Europe
MacDermid Alpha Electronics Solutions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.
Assembly, Circuitry, Semiconductor
News
Earth Day
To commemorate Earth Day and the anniversary of our businesses, we are excited to announce that the ESI Foundation has made a $15,000 donation to The Canopy Project.
Assembly, Semiconductor
Press Release
Electrolube to Showcase Conformal Coatings Expertise at SbSTC Shenzhen Technical Conference
MacDermid Alpha Electronics Solutions, will showcase the Electrolube’s newest advances in Conformal Coatings and Encapsulation Resin technologies at their first of four SbSTC technical conferences.
Assembly, Circuitry, Semiconductor
News
The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority.
Assembly, Circuitry, Semiconductor
Press Release
New Global Product Managers Appointed for the Electrolube Brand of Resins and Coatings
MacDermid Alpha Electronics Solutions has announced the appointments of Saskia Hogan and Beth Massey as new Global Product Managers for the Electrolube brand.
Assembly, Circuitry, Semiconductor
Press Release
New Low Temperature Solder Paste to be featured at SMTA Huntsville Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.
Assembly, Circuitry, Semiconductor
Press Release
Technical Presentation on High Reliability Materials for 3D Structural Electronics at LOPEC 2022 Exhibition and Conference
MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha to feature enhanced reliability solder pastes at SMTA Rocky Mountain & Dallas Expos
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Releases CircuEtch 300 Anisotropic Final Etch for SAP and mSAP
MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha to Exhibit and Present at the IMAPS Device Packaging Conference
MacDermid Alpha Electronics Solutions, will be exhibiting and presenting a paper at the IMAPS Device Packaging Conference at the WeKoPa Resort and Conference Center, Fountain Hills, AZ, March 7-10, 2022.
Germany
PCIM Europe
Trade Show
Assembly, Semiconductor
Discover MacDermid Alpha’s range of integrated solutions for package attach, die attach and top attach including the Argomax® portfolio of sinter materials and ATROX® conductive and non-conductive die attach pastes and films. Visit us in Hall 7 Booth #460.
China
Productronica China 2023
Trade Show
Assembly, Semiconductor
MacDermid Alpha Electronics Solutions will be presenting their latest integrated solutions for circuit board and semiconductor assembly at Productronica China Booth #4528 Hall N4, Longyang Road, Pudong New District 201204 Shanghai China.
United States
IMAPS Device Packaging Conference & Expo 2023
Trade Show
Circuitry, Semiconductor
Discover solutions for advanced interconnect metallization and assembly materials used in leading-edge chip fabrication and wafer-level packaging. MacDermid Alpha supplies leading-edge technologies that enable the highest end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry. Booth 31-32
United States
IPC APEX 2023
Trade Show
Assembly, Circuitry, Semiconductor
Discover the latest Assembly, Circuitry, and Semiconductor Technologies.
United States
IMAPS Device and Packaging 2022 Booth # 23/24
Trade Show
Assembly, Circuitry, Semiconductor
Discover the latest solutions of Alpha, Electrolube, Kester, MacDermid Enthone, and Electrolube # 23/24
United States
SMTA Rocky Mountain Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover Alpha and Kester’s latest solutions for solder joint ruggedization at this one-day event.
United States
SMTA Dallas Chapter Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Visit our table at this one day event to discover our latest high reliability and low temperature assembly solutions.
United States
Huntsville Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Featuring ALPHA OM-565 HRL3 solder paste, high reliability solutions including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy, and the ALPHA HiTech series of adhesive, edgebond, and underfills.
United States
Michigan Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover solutions optimized to meet the most demanding electrical and thermo-mechanical reliability requirements for even the most complex automotive assemblies.
Mexico
Juarez Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover MacDermid Alpha’s low voiding solutions which increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Additionally, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum.
United States
MacDermid Alpha Webinar: “The Critical Role of Getters in Hermetic Packages”
Webinar/Online
Circuitry, Semiconductor
Michael Previti will be presenting “The Critical Role of Getters in Hermetic Packages”.
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