News & Events

Kevin Martin of the Assembly Division at MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, “Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?” on April 19 at 10:30 am New York / 3:30 pm London.

MacDermid Alpha Electronics Solutions has announced the appointments of Saskia Hogan and Beth Massey as new Global Product Managers for the Electrolube brand.

The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.

Ravi Bhatkal, Managing Director - India, presented to The Centre for Nano Science and Engineering (CeNSE) on Advanced Materials in Electronics Manufacturing.

Watch interview with EMSNOW - Up Close With Paul Salerno on applications and advantages of low temperature solder.

MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.

MacDermid Alpha Electronics Solutions, announces the launch of ALPHA OM-565 HRL3, next generation, high reliability low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages.

The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.

MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.

(Waterbury, CT USA) – February 14, 2022 - The Power Electronics Division of MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Automotive Traction Module Attach by Silver Sintering – Process, Performance, and Reliability” at the APEC 2022 Power Conference taking place from March 20-24, 2022 in Houston, Texas.

MacDermid Alpha Electronics Solutions, will be exhibiting and presenting a paper at the IMAPS Device Packaging Conference at the WeKoPa Resort and Conference Center, Fountain Hills, AZ, March 7-10, 2022.

MacDermid Alpha Electronics Solutions, announces the appointment of Karl Pfluke as District Sales Manager of the Southeast supporting the Alpha and Kester Assembly brands.