News & Events

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MacdermidAlpha-Market
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Solder Paste Printing and Optimization for Interconnecting Back Contact Cells
Assembly
Press Release
'Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells' Article Published in SMT007 Magazine
Narahari Pujari, Senior Global Product Manager, PV and Krithnika PM discuss ‘Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells’ in latest article published in July's SMT007 Magazine.

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Automotive Applications at HiTEN 2022
Assembly
Press Release
High Performance Solder Alloys Presented at Automotive Applications at HiTEN 2022
MacDermid Alpha Electronics Solutions, will present its High Performance Solder Alloys for Automotive Applications at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN) in Oxford, UK from the 18th-20th July.

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MAES Appoints Barbieri
Assembly
Press Release
MacDermid Alpha Appoints Barbieri and Kosmedue as Official Kester Distributors in Italy
MacDermid Alpha Electronics Solutions, is excited to announce the extension of the distribution partnerships with current Italian ALPHA brand distributors Barbieri and Kosmedue to include the distribution of Kester brand products in Italy.
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HRL3 Solder Spheres
Assembly, Circuitry, Semiconductor
Press Release
Product launch of ALPHA HRL3 Solder Sphere
MacDermid Alpha Electronics Solutions, announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications.
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Francisco Gallegos SMTA Juarez Paper post
Assembly
Press Release
Low Voiding Solutions Paper to be Presented at SMTA Juarez
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will present a paper on low voiding solutions at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
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MacDermid Alpha at PCIM Europe
Assembly, Semiconductor
Press Release
MacDermid Alpha to Promote New ALPHA® Argomax® AccuLam™ Sintering Film and Package Attach Sintering Application at PCIM Europe
MacDermid Alpha Electronics Solutions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.
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Michigan SMTA Conference and Expo May 17, 2022
Assembly
Press Release
High Reliability Solutions and Recycling Services featured at SMTA Michigan Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.
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MacDermid Alpha at SMT connect
Assembly
Press Release
Low Temperature Soldering and Conformal Coating Innovations presented at SMTconnect
MacDermid Alpha Electronics Solutions, will showcase its latest product innovations from the ALPHA, Kester and Electrolube brands at the upcoming SMTconnect exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 4 Booth # 125.
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Globalspec Webinar
Assembly
Press Release
Webinar offered on Innovative Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
MacDermid Alpha Electronics Solutions, in partnership with Globalspec will host “Low Temperature Solder Solutions for Defect-free Next Generation Package Designs” webinar presented by Paul Salerno, Global Portfolio Manager for SMT Solutions on Wednesday, May 25 at 2:00 pm EDT.
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Earth Day MAES
Assembly, Circuitry, Semiconductor
News
Earth Day
To commemorate Earth Day and the anniversary of our businesses, we are excited to announce that the ESI Foundation has made a $15,000 donation to The Canopy Project.
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Conformal Coatings
Assembly, Semiconductor
Press Release
Electrolube to Showcase Conformal Coatings Expertise at SbSTC Shenzhen Technical Conference
MacDermid Alpha Electronics Solutions, will showcase the Electrolube’s newest advances in Conformal Coatings and Encapsulation Resin technologies at their first of four SbSTC technical conferences.
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Carbon Footprint Article
Assembly, Circuitry, Semiconductor
News
The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority.
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Lopec Conference logo and dates of event
Germany
LOPEC 2022 International Exhibition / Conference for Printed Electronics
Conference
Assembly
International Exhibition and Conference for Printed Electronics. LOPEC is the leading conference and exhibition on the hot topic of organic and printed electronics. MacDermid Alpha will be presenting its latest research at this event.
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SMTA Huntsville
United States
Huntsville Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Featuring ALPHA OM-565 HRL3 solder paste, high reliability solutions including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy, and the ALPHA HiTech series of adhesive, edgebond, and underfills.
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GLOBAL SMT Webinar
United States
Panel Discussion on Head-in-Pillow defects. Global Webinar hosted by Global SMT& Packaging.
Webinar/Online
Assembly
Kevin Martin joins a panel of industry experts hosted by Global SMT& Packaging to discuss head-in-pillow (HiP) defects, causes, and solutions.
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SMTConnect Logo
Germany
SMTconnect - Electronics Production Tradeshow
Trade Show
Assembly
The latest product and technology innovations from the ALPHA, Kester and Electrolube brands of MacDermid Alpha Electronics Solutions will be showcased at the SMTconnect tradeshow. Visit us in Hall 4 Booth #125
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PCIM 2022 Show May 2022
Germany
PCIM - Power Electronics Tradeshow and Conference
Trade Show
Assembly
MacDermid Alpha Electronics Solutions will exhibit its latest developments in Power Electronics Solutions at the PCIM tradeshow. Visit us in Hall 7 Booth #227
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Michigan SMTA Conference and Expo May 17, 2022
United States
Michigan Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover solutions optimized to meet the most demanding electrical and thermo-mechanical reliability requirements for even the most complex automotive assemblies.
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Shenzhen Conference
China
SbSTC Shenzhen Technical Conference 2022
Conference
Assembly
Harvey Han, Product Manager of Electrolube, will be presenting a paper related to conformal coating at the SbSTC Shenzhen technical conference.
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SMTA Juraez Expo
Mexico
Juarez Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover MacDermid Alpha’s low voiding solutions which increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Additionally, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum.
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Image of warped circuit board to demonstrate issues and success with low temp solders
United States
Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
Webinar/Online
Assembly
Webinar May 25 at 2 pm EST. Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.
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Getters Webinar
United States
MacDermid Alpha Webinar: “The Critical Role of Getters in Hermetic Packages”
Webinar/Online
Circuitry, Semiconductor
Michael Previti will be presenting “The Critical Role of Getters in Hermetic Packages”.
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JPCA 2022
Japan
JPCA Show
Trade Show
Assembly, Circuitry, Semiconductor
MacDermid Alpha Electronics Solutions will be exhibiting at the JPCA show in Tokyo, Japan. 
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HiTen Paper Presentation
United Kingdom
HiTEN 2022
Conference
Assembly
Alan Plant will be delivering the paper ‘Unveiling High Performance Solder Alloys for Automotive Applications’ at the upcoming International Conference and Exhibition on High Temperature Electronics Network (HiTEN) in Oxford, UK.
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