News & Events

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

The Kester brand of MacDermid Alpha Electronics Solutions will be represented by China Distributor, Shanghai Fairfield Electronic Technology Co., Ltd., at the China International Optoelectronic Exposition (CIOE) in Shenzhen, China from September 9-11.

The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will introduce its new ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

MacDermid Alpha Electronics Solutions will participate in two online panel discussions on Tuesday 2nd June; Recent Advances in Low Temperature Solders hosted by Global SMT & Packaging, and the SMT Printing Round Table hosted by the Surface Mount Technology Association (SMTA).

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces Rick Fricke will be joining MacDermid Alpha Electronic Solutions (MAES) as the Vice President and General Manager of their Semiconductor Solutions division.

MacDermid Alpha Electronics Solutions will exhibit total process solutions for emerging packaging at the IMAPS Conference, Fountain Hills, AZ, March 3-5, 2020.

MacDermid Alpha Electronics Solutions announces the release of STAYDRY® Z20 – Moisture Getter for hermetic packages. STAYDRY Z20 is a silicone film moisture getter with a newly developed proprietary backing adhesive that meets rigid outgassing and adhesion testing for aerospace, telecom and medical applications, meeting MIL-STD-883K, Method 5011.6.

MacDermid Alpha Electronics Solutions will feature Affinity 2.0, their highly stable, low corrosion ENIG process and the ALPHA® HiTech™ portfolio of low temperature adhesives, encapsulants, and underfills, at the IPC APEX Conference and Expo, February 1-6, in San Diego, California.