BROWSE PRODUCTS & PROCESSES BY CATEGORY

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Wires plugging into their outlet
Connectors and Interconnect Finishes
Chemical processes for the application of long lasting corrosion resistant coatings for connectors and interconnects.
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Close-up of circuit board components
Copper Adhesion Promotion
A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates.
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Circuit board components
Electrolytic Copper
A full portfolio of acid copper products that meet all applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias.
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Circuit board components
Final Finishes
Our industry leading portfolio of surface preparation and plating processes make us the market choice for organic and metallic final finishes.
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IC Sub
IC Substrates
Our IC substrate solutions today enable the high density designs of the future.
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CS-T7-Lead Frame Packaging
Leadframe Packaging
From specialty applications to technology-enabling solutions allowing for thinner, faster devices, we have everything you need to bridge the performance gap to your next-generation product.
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Memory disk
Memory Disk
The world's largest manufacturer of electroless nickel chemistry for memory disk applications.
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MID
Molded Interconnect Devices
MID plating solutions specifically optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices.
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Solar panel
Photovoltaics
Optimizing solar cells one chemical at a time.
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Primary Metallization
Primary Metallization
Through continued innovation, we develop new solutions to meet the ever-changing electronics manufacturing landscape.
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CS-T7-Process Chemistry
Process Chemistry
We provide innovative chemistries to aid in all aspects of printed circuit formation.
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Selective dielectric plating
Selective Dielectric Plating
Printing and plating process utilizing proven technology that can satisfy the demand for high volume advanced circuitry.
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