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5G Solutions

Enabling 5G From Start to Finish

Affinity™ 2.0

Electroless Nickel / Immersion Gold

Affinity™ 3.0

Hybrid Gold Technology for ENIG/ENEPIG Final Finishes

AlphaSTAR®

Immersion Silver for Lead-free Soldering

Blackhole®

Direct Metallization

Blackhole® LE

Low Etch Carbon-Based Direct Metallization System

CircuEtch 300

Anisotropic Final Etching Process for SAP and mSAP

Eclipse™

Direct Metallization

Eclipse™ LE

Low Etch Carbon-Based Direct Metallization System

Electrolytic Copper Metallization

Product Selection Guide

Enklad Pretreatment

High Performance Pretreatment for Memory Disk

ENTEK® Plus HT

Organic Solderability Preservative

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