News & Events

In line with the latest REACH Annex XIV regulations banning the use of Nonylphenol Ethoxylate (NPE) and Octylphenol Ethoxylate (OPE) based surfactants due to come into effect in Europe on the 4th January 2021, MacDermid Alpha is ready to offer customers soldering products that ensure compliance to the regulation.

The Assembly Division will be presenting the paper, “Power Package Attach by Silver Sintering – Process, Performance & Reliability“ at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.

The Assembly Division of MacDermid Alpha Electronics Solutions will present “Introduction to Sintering Products” at the Step-by-Step Technical Conference on Thursday, November 5th, 2020 in Hangzhou, China.

MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.

The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper, “Alpha Power Electronics Solutions” at the 3rd China Powertrain Electrification and Innovation Summit 2020 – New Energy Vehicle 2.0 Era from October 22-23, 2020 in Shanghai, China.

MacDermid Alpha Electronics Solutions will be hosting a series of free webinars covering the basics of building a printed circuit board. The series will begin Tuesday, October 27, 2020 1:00 – 3:00pm EST and will run every Tuesday until November 17.

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

The Kester brand of MacDermid Alpha Electronics Solutions will be represented by China Distributor, Shanghai Fairfield Electronic Technology Co., Ltd., at the China International Optoelectronic Exposition (CIOE) in Shenzhen, China from September 9-11.

The Assembly Division will be presenting two technical papers; “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” and “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.

MacDermid Alpha Electronics Solutions announces the release of Systek ETS 1200, the latest addition to the Systek family of IC Substrate manufacturing solutions.

The Assembly Division of MacDermid Alpha Electronics Solutions will present the technical paper “Advantages of Solder Paste in Shingling Interconnection” during the SNEC 14th (2020) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place from August 7-10 in Shanghai, China.