News & Events
Assembly
Press Release
MacDermid Alpha Offers Full Line of Environmentally Friendly, REACH Compliant Soldering Products
In line with the latest REACH Annex XIV regulations banning the use of Nonylphenol Ethoxylate (NPE) and Octylphenol Ethoxylate (OPE) based surfactants due to come into effect in Europe on the 4th January 2021, MacDermid Alpha is ready to offer customers soldering products that ensure compliance to the regulation.
Assembly
Press Release
Presentation on Power Package Attach by Silver Sintering at PCIM Asia Conference
The Assembly Division will be presenting the paper, “Power Package Attach by Silver Sintering – Process, Performance & Reliability“ at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
Assembly
Press Release
Sintering Products Introduced at the Step-by-Step Technical Conference in China
The Assembly Division of MacDermid Alpha Electronics Solutions will present “Introduction to Sintering Products” at the Step-by-Step Technical Conference on Thursday, November 5th, 2020 in Hangzhou, China.
Circuitry
Press Release
Product Launch - MacuSpec VF-TH 300 V-Pitting Resistant Pattern Plating Metallization for Advanced HDI PCBs
MacDermid Alpha Electronics Solutions announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.
Assembly
Press Release
Power Electronics Solutions Featured at China Powertrain Electrification and Innovation Summit
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper, “Alpha Power Electronics Solutions” at the 3rd China Powertrain Electrification and Innovation Summit 2020 – New Energy Vehicle 2.0 Era from October 22-23, 2020 in Shanghai, China.
Circuitry
Press Release
Hosting a Series of Online Webinars: PCB101 The Basics of Printed Circuit Board Fabrication
MacDermid Alpha Electronics Solutions will be hosting a series of free webinars covering the basics of building a printed circuit board. The series will begin Tuesday, October 27, 2020 1:00 – 3:00pm EST and will run every Tuesday until November 17.
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Exhibiting at TPCA and Presenting at IMPACT-EMAP 2020 Conference
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
Recent Product Launches Exhibited and Promoted at Semicon Taiwan
MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
Assembly, Circuitry, Semiconductor, Compugraphics
Press Release
MacDermid Alpha’s Kester Brand to Exhibit at China International Optoelectronic Exposition
The Kester brand of MacDermid Alpha Electronics Solutions will be represented by China Distributor, Shanghai Fairfield Electronic Technology Co., Ltd., at the China International Optoelectronic Exposition (CIOE) in Shenzhen, China from September 9-11.
Assembly
Press Release
Void Reduction & Silver Free Alloy Solutions Presented at SMTA South China Technology Conference
The Assembly Division will be presenting two technical papers; “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” and “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Circuitry
Press Release
Product Launch - Systek ETS 1200 Pattern Plating Metallization for Embedded Trace Substrates
MacDermid Alpha Electronics Solutions announces the release of Systek ETS 1200, the latest addition to the Systek family of IC Substrate manufacturing solutions.
Assembly
Press Release
Technical Presentation on Advantages of Solder Paste in Shingling Interconnection at SNEC PV Power Expo China
The Assembly Division of MacDermid Alpha Electronics Solutions will present the technical paper “Advantages of Solder Paste in Shingling Interconnection” during the SNEC 14th (2020) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place from August 7-10 in Shanghai, China.