News & Events

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MacdermidAlpha-Market
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ITB Smart Automotive
Assembly, Circuitry, Semiconductor
Press Release
Technical Presentation on MacDermid Alpha’s Conductive Silver Inks at the Smart Automotive Surfaces Conference
MacDermid Alpha Electronics Solutions will present ‘Electronic Materials for Smart, Functional and 3D Automotive HMI Structures’ at the Smart Automotive Surfaces Conference on October 7th, Novi, Michigan USA.
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ALPHA WS-826
Assembly
Press Release
Product Launch - ALPHA WS-826 Robust Water Soluble Solder Paste
MacDermid Alpha Electronics Solutions has launched a new water soluble solder paste, ALPHA WS-826, designed to provide excellent environmental stability even in extreme operating conditions.
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Event_SMTA Space Coast Chapter 21
Assembly, Circuitry, Semiconductor
Press Release
High Reliability Solutions Featured at SMTA Space Coast Expo & Tech Forum
High Reliability Solutions will be featured at the SMTA Space Coast Expo & Tech Forum on Thursday, October 7th at the Melbourne Auditorium in Melbourne, Florida.
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Soldering Forum
Assembly, Circuitry, Semiconductor
Press Release
Participating at the Soldering Forum 2021 in Partnership with smartTec GmbH
The Assembly Division of MacDermid Alpha Electronics Solutions will participate at the upcoming Soldering Forum 2021 hosted by its ALPHA product distributor for Germany, Austria, and Nordic, smartTec GmbH from October 5th-7th in Rodgau, Germany.
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SMTA Tampa Expo & Tech Forum
Assembly, Circuitry, Semiconductor
Press Release
Low Temperature Solutions Featured at SMTA Tampa Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at SMTA Tampa Expo & Tech Forum on Tuesday, October 5th at the University of South Florida in Tampa, Florida.
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News_SMTA Empire
Assembly, Circuitry, Semiconductor
Press Release
ALPHA HiTech Portfolio Featured at SMTA Empire Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Empire Expo & Tech Forum on Tuesday, September 28th at the RIT Inn & Conference Center in Henrietta, New York.
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EU PVSEC
Assembly
Press Release
Paper Presentation on Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference
MacDermid Alpha will present the paper “Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells” at the upcoming virtual European PV Solar Energy Conference and Exhibition, taking place from the 6th-10th September 202.
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Lenz SP
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Electronics Solutions Celebrates 25 Years of Partnership with Distributor Lenz SP.j
The Assembly Division of MacDermid Alpha Electronics Solutions has celebrated 25 years of partnership with Lenz SP.j, its distributor of ALPHA brand products in Poland.
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News_PCIM Asia 20_31Aug2021
Assembly
Press Release
Sintering Process Solutions Introduced at PCIM Asia in China
The Assembly Solutions divisionwill introduce its sintering process solutions at PCIM Asia at the Shenzhen World Exhibition Center in Shenzhen, China from September 9-11, 2021.
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News_Microfab EVF NiBar_Product Release_2Sep2021
Semiconductor
Press Release
Product Launch - MICROFAB® EVF NiBAR Boric Acid Free Electrolytic Nickel
MacDermid Alpha Electronics Solutions and electronics assembly announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.
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SMTA Ohio Valley Expo & Tech Forum
Assembly
Press Release
High Reliability Solutions Featured at SMTA Ohio Valley Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Ohio Valley Expo & Tech Forum on Wednesday, August 25th at the Holiday Inn in Strongsville, Ohio.
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SMTA China South Technical Conference 2021
Assembly
Press Release
Technical Paper Presented at SMTA China South Technical Conference 2021
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: “The Interaction of Two Solder Paste Alloys With 5 Surface Finishes” at the SMTA China South Technical Conference taking place from August 25 - 26 in Shenzhen, China.
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