News & Events

MacdermidAlpha-Market
Clarke Dai Article
Assembly, Semiconductor
Multimedia
Clark Dai - Meet an Expert from the Electric Vehicle Industry
Read this Q&A article with Clark Dai, one of our EV Technology market managers, as he explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry.
PCIM Europe PR pic
Assembly, Semiconductor
Press Release
Unveiling Ground-Breaking Innovations at PCIM Europe: Visit MacDermid Alpha Electronics Solutions to Discover More
MacDermid Alpha Electronics Solutions, a leader in integrated technologies and materials for the electronics industry, is set to showcase advanced solutions for die, package, and top-side attach at PCIM Europe. Held at the Nuremberg Exhibition Grounds, from June 11 to 13, MacDermid Alpha’s expertise and product portfolio will be on display in Hall 7, Booth 460.
William Yu
Assembly, Semiconductor
News
Best Paper Award at SMTA China East Technology Conference
William Yu, our business development manager, won the Best Paper Award at the 2024 SMTA China East Technology Conference for the technical paper: Next-generation High-reliability Solder for Enabling Enhanced Thermo-mechanical Performance in Automotive Applications.
Innolot MXE Yellow
Assembly, Semiconductor
Press Release
Empowering Electronics Assembly: Introducing ALPHA® Innolot® MXE Alloy
In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. “As an industry partner, we understand the importance of staying at the forefront of market trends. With Innolot MXE, we provide a groundbreaking solution that supports the highest standards of quality and performance” said Ebad Rehman, Product Manager, Solder Paste in the Americas, and Europe.
ADAS Ch 3
Assembly, Semiconductor
Multimedia
Advanced Driver Assistance Systems (ADAS): It’s Not What, It’s How
Read this article by Rainer Venz, on ADAS: It’s not what, it’s how...
Patent infringement PR - Logos
Assembly, Circuitry, Film and Smart Surface Solutions, Semiconductor, Compugraphics
Press Release
MacDermid Alpha Electronics Solutions, Heraeus Electronics, and Henkel Win Patent Infringement Lawsuit Against Senju Group
Alpha Assembly Solutions (MacDermid Alpha), Heraeus, and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH, and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju’s infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.
APEX GRAPHIC 2024
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Advances Reliability and Performance, showcasing Next Generation Solutions at IPC APEX 2024
MacDermid Alpha Electronics Solutions, a leading global provider of advanced chemistries and material solutions for the electronics industry, is proud to announce its participation at IPC APEX 2024, held April 9-11, at the Anaheim Convention Center in Anaheim, CA. 
cooling board
Assembly, Semiconductor
Multimedia
Eliminating Hotspots On Printed Circuit Boards
With the continued miniaturization of automotive electronics, PCB (Printed Circuit Board) designers must consider the thermal demands in these smaller assemblies. This is especially true in PCBs that operate at high current-carrying capacity, as the increases in heat can lead to “hotspots”. In turn, these hotspots can cause warped, blistered, or even burnt boards, leading to premature component failure.
ADAS Chapter 3
Assembly, Semiconductor
Multimedia
Autonomust-feelings: Why Emotions Are Driving Autonomous Vehicle Brand Perception
Read this article by Lenora Clark, Director, Technology Marketing and ADAS on Why Emotions Are Driving Autonomous Vehicle Brand Perception
Wafers
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Electronics Solutions Showcases Breakthrough PFAS-Free Materials and Sustainable Integrated Solutions at Productronica China 2024
MacDermid Alpha Electronics Solutions, a global leader in innovative electronic materials, is proud to announce its participation in Productronica China 2024, taking place from March 20-22 at the Shanghai New International Exhibition Center (SNIEC) in Shanghai.
wafer-level_packaging
Assembly, Semiconductor
Press Release
Next-generation Tin Silver Bump Metallization Process improves precision, reliability, and performance.
MacDermid Alpha Electronics Solutions Launches MICROFAB TS-650 NXG for the growing requirements of the Wafer Level Packaging industry.
PCB cross section
Assembly, Semiconductor
Press Release
Unlock Tomorrow's Semiconductor Potential with MacDermid Alpha Electronics Solutions to enhance advanced package reliability and performance at IMAPS 2024
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is participating at the IMAPS 20th Annual Device Packaging Conference, Arizona March 18-21.  We will feature key technology innovations that enable advanced packages to meet the semiconductor industry’s demand for higher performance and enhanced reliability.
JPCA 2024
Japan
Addressing PCB Reliability, High-Density Designs, and Sustainability at the JPCA Show
Trade Show
Circuitry, Semiconductor
MacDermid Alpha addresses the printed circuit board industry’s requirements for enhanced reliability, high-density designs, and sustainability at the JPCA Show. Showcasing its latest advancements in direct metallization technology and solutions for IC substrates, please come and find our team of experts who look forward to meeting you - booth #5F-17.
PCIM Europe
Germany
MacDermid Alpha is attending PCIM Europe 2024
Trade Show
Assembly, Semiconductor
Discover new advancements in power electronics as we will showcase our advanced solutions for die, package, and top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, June 11th-13th. Our expertise and product portfolio will be on display in hall 7, booth 460.
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