Paper Presentation on Ultra-Low Temperature Solder for Flexible Hybrid Electronics at Virtual Conference

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AS Ultra low temp - News 24Aug21

May 6, 2021 – MacDermid Alpha Electronics Solutions will be presenting “Ultra-Low Temperature Solder for Flexible Hybrid Electronics” at the upcoming virtual conference on Printed, Hybrid, Structural and 3D Electronics event hosted by TechBlick on May 11 and 12, 2021.

Rahul Raut, Director of Strategy and Technology Acquisition, will present on MacDermid Alpha’s latest advances in ultra-low temperature solders which target the fast growing flexible hybrid electronics market. His presentation will focus on innovative chemistries which enable soldering at peak reflow temperatures below 150°C, as well as permitting cascaded/hierarchical soldering, including novel hermetic sealing solutions. These capabilities are ideal for soldering heat sensitive components and sub-assemblies. “With ALPHA OM-220 ultra-low temperature solder paste, which enables soldering below 150 °C, we can now use heat-stabilized PET substrates in flexible hybrid electronics”, said Rahul Raut.“This capability opens up tremendous options for more sophisticated FPC assemblies.”

The TechBlick virtual event will be held from May 11 - 12, 2021. To register for this presentation, click here (TechBlick) . More information about MacDermid Alpha’s solutions for flexible and in-mold electronics can be found at (link).

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