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View Products in HiTech Adhesives and Encapsulants
- ALPHA® HiTech HT-130DHF-3 Adhesive
ALPHA HT-130DHF-3 Adhesive is a one component, fast curable surface mount adhesive designed for both dispensing & printing applications.
- Leading surface mount adhesive for both printing and dispensing
- Highest cured Tensile Strength
- Excellent adhesion on common PCB board materials
- Excellent thermal resistance during wave soldering process
- Complies with RoHS Directive 2011/65/EU
- Halogen-free
- ALPHA® HiTech AD13-9910B Adhesive
ALPHA HiTech AD13-9910B is a one-component, ultra-low temperature cure epoxy system that can be cured at temperatures as low as 60°C.
- Excellent dispensing performance – jetting [< 35°C at nozzle], time/pressure or auger
- Fast cure at very low temperatures
- Meets market reliability requirements including adhesion strength at high humidity/high temperatures
- Halogen-Free
- Complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech AD13-9692B Adhesive
ALPHA HiTech AD13-9692B is a one-component, low temperature cure epoxy system. It is suitable for bonding heat sensitive devices and is specially designed for camera module application.
- Fast Cure at Low Temperature
- Excellent Drop Shock for units bonded to LCP
- Halogen Free
- Complies with RoHS Directive 2011/65/EU
- ALPHA® HiTech AD13-9521B Adhesive
ALPHA HiTech AD13-9521B is a one-component low temperature cure epoxy system. It is suitable for bonding heat sensitive devices.
- Low Viscosity
- Excellent Penetration /Fast Flow
- Halogen-free and complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech AD13-9620B Adhesive
ALPHA HiTech AD13-9620B is a one-component, low temperature cure epoxy system. It is developed for the bonding of heat sensitive devices.
- No Flow
- Fast Cure at low temperature
- Excellent Adhesion on Liquid Crystal Polymer (LCP) and metal substrates. It is also able to bond well on Nylon (PA9T) and Polycarbonate surfaces.
- Excellent Drop Shock
- Halogen-free and complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech AD43-9600W Adhesive
ALPHA HiTech AD43-9600W is a one-component, low temperature cure epoxy system. It is specially designed to bond the lens onto a PCB bar for BLU (Back Light Unit) application.
- Excellent Adhesion on FR4 and PMMA lens
- White appearance to avoid ‘flaring’ phenomena when LED is lighted up
- Halogen-free
- Complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech SM42-120P Adhesive
ALPHA HiTech SM42-120P is a one component, fast curable surface mount adhesive, specially designed for screen printing.
- Rheology specially designed for high throughput printing process
- Non-Sagging
- Excellent adhesion on common PCB board materials
- Excellent thermal resistance during wave soldering process
- Halogen-free and complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech SM42-1311 Adhesive
ALPHA HiTech SM42-1311 is a one component, fast curable surface mount adhesive designed for dispensing applications.
- Rheology specially designed for high throughput dispensing process
- Excellent adhesion on common PCB board materials
- Excellent thermal resistance during wave soldering process
- Complies with RoHS Directive 2011/65/EU
- Halogen-free
- ALPHA® HiTech UP44-5566T Adhesive
ALPHA HiTech UP44-5566T is a one-component UV cure system. It is suitable for fast curing and bonding in various applications such as coating and fixing of components.
- Fast Cure under a UV Light Source
- Excellent Adhesion
- Halogen-free
- Complies with RoHS Directive 2015/863/EU
- ALPHA® HiTech EN31-4007B Encapsulant
ALPHA HiTech EN31-4007B is a one-component epoxy system designed to improve the attachment strength of solder joints by encapsulating the material over the chip component.
- Excellent Impact Bending
- Excellent Drop Shock
- Excellent Impact Resistance
- Highly Reworkable
- Possesses Waterproofing Property
- Halogen-free and complies with RoHS Directive 2015/863/EU
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