Product Overview

ALPHA Accuflux Preforms for power electronics are an ideal solution for applications that require low voiding in large area solder joints and a low flux residue.  

The flux application process for ALPHA Accuflux preforms is unique and guarantees each preform will have the same amount of flux within tightly controlled range.  The low flux weight required to yield good solder wetting results in significantly reduced voiding levels.  

Product Features

  • Various larger area preform sizes and thicknesses available
  • Fast placement using standard pick and place equipment
  • Non-tack flux formulation compatible with vacuum pick up systems
  • Available in standard alloys plus Innolot, Powerbond and high Pb alloys
  • Can be combined with ALPHA TrueHeight bondline control preforms  
  • EIA-481 tape and reel packaging
     
Documentation icon - Technical Bulletin

Technical Bulletins

ALPHA Accuflux Flux Types and Applications for Power Electronics

ALPHA Accuflux Flux Types Table

Related Products

PRODUCT TYPEPRODUCT NAMECOMPATIBLE SURFACE FINISHPRODUCT APPLICATION METHODEND APPLICATION
Bond line Control PreformsALPHA TrueHeight PreformsAll solderable surfacesPick & PlaceClip Attach / Substrate Attach
Pb-free, High temp Alloy PreformsALPHA PowerBond PreformsAll solderable surfacesPick & PlaceSubstrate Attach / Other
Innolot Alloy PreformsInnolot PreformsAll solderable surfacesPick & PlaceSubstrate Attach / Other
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