Product Overview

ALPHA WS9160-M7 water soluble flux is engineered to be used in the attachment of Sn-Pb Eutectic or Pb-free spheres onto BGA, CSP or wafer level components. It is compatible with Cu-UBM, Cu-OSP, electrolytic Ni-Au and ENIG pad finishes.

Features
  • Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
  • Excellent wettability: Excellent activity reduces the occurrence of dark balls
  • Excellent cleanability: Flux residues are removed easily with warm DI water
  • High tackiness allows high yields for wafer level ball attach

Water Soluble Flux

ALPHA WS9160-M7
Image
TDS-icon
TDS

ALPHA WS9160-M7

Product Name

Flux Type

Flux Process

Component Type

ALPHA WS9160-M7

No Clean

Ball Attach
Flip Chip Attach

BGA / CSP
WLP

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