Product Overview

ALPHA WS-608 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.

The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-608 can be used as a pre-cleaning flux for oxidized Cu-OSP boards. Its high activity formulation allows it to also be used as a single-step ball attach flux on Cu-OSP boards. It is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.

Features

  • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
  • Superior wetting maximizing assembly yields to provide highest ball attach yield rates
  • Excellent cleanability performance in that residues are easily cleaned with DI water

High Activity Water-Soluble Flux for Semiconductor Applications

Technical Data Sheets
TDS-icon

ALPHA WS-608 Technical Data Sheet English

ALPHA WS-608

Product Name

Flux Type

Flux Process

Component Type

ALPHA WS-608

Water Soluble

Ball Attach
Flip Chip Attach

BGA / CSP
FC

What do you need solved?
Let our experts find your solution.