Product Overview

The MICROFAB SC acid copper plating formulation provides excellent throwing power, improved leveling characteristics, and ductile low stress deposits.

Features

  • Good coplanarity
  • Versatility
  • Ease-of-use

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MICROFAB SC 

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB SC

Pillar/Post
RDL

Good Coplanarity

Ease-of-Use

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-32 MICROFAB SC-40 MICROFAB SC-50

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-32 MICROFAB SC-40 MICROFAB SC-50

Historical POR used on Flip chip Pillars and RDL Patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR used on Flip chip Pillars and RDL Patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-32 MICROFAB SC-40 MICROFAB SC-50

Key Barrier Materials and Solders to Produce High Reliability Interconnects

  • Pillar/Post, RDL
MICROFAB EVF NiBAR MICROFAB NI-200 MICROFAB NI-100 MICROFAB TS-650 MICROFAB SN-350 MICROFAB SN-300/302 MICROFAB SC-32 MICROFAB SC-40 MICROFAB SC-50

Historical POR used on Flip chip Pillars and RDL Patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR used on Flip chip Pillars and RDL Patterns

Original formulation of MICROFAB SC is the foundation for higher speed versions; SC-32 and re-formulated SC-40 and SC-50.

Wafer Level Packaging System in Package (SiP) Heterogeneous Integration

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post

Historical POR Wafer Bumping

Historical POR for WLP pillar, UBM and RDL features. Two-part additive system for ease of use.

UBM Backside Metal Wafer Bumping RDL Pillar / Post
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