Product Overview

The MICROFAB GSW-200 copper process is a unique acid copper plating system designed for filling blind vias across a variety of geometries. The process produces a bright, fine grained, ductile deposit with excellent physical properties. The process enables complete via filling while minimizing surface deposition, reducing cycle time and eliminating the need for planarization.

This MICROFAB GSW-200 Copper Process enables the use of stacked via constructions as well as increasing reliability for via-in-pad designs.

Features

  • Excellent bottom up fill
  • Flat bump shape

For consultation with one of our experts and access to detailed technical data , please fill out and submit the contact us form.

Plating Copper-Macdermid Alpha

Superior Bottom Up Fill and Flat Pad

MICROFAB GSW-200 was developed to fill conformal vias with large pads. This solution excels at stepped via’s and is void free, seam free fast filling.

MICROFAB GSW-200

Product Name

Cu Packaging Solution

Cu Process Feature

Feature-Property Benefit

MICROFAB GSW-200

Viafill

Excellent Bottom Up Fill

Flat Bump Shape

Key Barrier Materials and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill
Plating - Nickel Plating - Solder

Key Barrier Materials and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill
Plating - Nickel Plating - Solder

Key Applications for MICROFAB GSW-200

MICROFAB GSW-200 is a high speed fill chemistry for a variety of feature sizes.

Wafer Level Packaging Heterogeneous Integration (2.5/3D) Power Semiconductor

Key Applications for MICROFAB GSW-200

MICROFAB GSW-200 is a high speed fill chemistry for a variety of feature sizes.

Wafer Level Packaging Heterogeneous Integration (2.5/3D) Power Semiconductor

Key Solutions for MICROFAB GSW-200

MICROFAB GSW-200 is perfectly matched with Ni barrier and solder interconnect.

Backside Metal Wafer Bumping UBM

Key Solutions for MICROFAB GSW-200

MICROFAB GSW-200 is perfectly matched with Ni barrier and solder interconnect.

Backside Metal Wafer Bumping UBM

Key Barrier Materials and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill
Plating - Nickel Plating - Solder

Key Barrier Materials and Solder Bumps / Caps

  • Pillar/Post 
  • Viafill
Plating - Nickel Plating - Solder

Key Applications for MICROFAB GSW-200

MICROFAB GSW-200 is a high speed fill chemistry for a variety of feature sizes.

Wafer Level Packaging Heterogeneous Integration (2.5/3D) Power Semiconductor

Key Applications for MICROFAB GSW-200

MICROFAB GSW-200 is a high speed fill chemistry for a variety of feature sizes.

Wafer Level Packaging Heterogeneous Integration (2.5/3D) Power Semiconductor

Key Solutions for MICROFAB GSW-200

MICROFAB GSW-200 is perfectly matched with Ni barrier and solder interconnect.

Backside Metal Wafer Bumping UBM

Key Solutions for MICROFAB GSW-200

MICROFAB GSW-200 is perfectly matched with Ni barrier and solder interconnect.

Backside Metal Wafer Bumping UBM
What do you need solved?
Let our experts find your solution.
Contact Us