Product Overview

ATROX NC200-3 is a electrically insulating die attach adhesive paste. ATROX NC200-3 is formulated to be applied via time pressure dispensing, with either single needle or showerhead configuration. It has a high glass transition temperature and a low temperature cure for excellent MSL performance on metal and substrate based semiconductor packages.

  • Low stress material for excellent reliability
  • Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu) and soldermask
  • Compatible with Bare Si and metalized die surfaces
Technical Data Sheet
TDS-icon

ATROX NC200-3 Die Attach TDS English

Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC300-1

Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC300-1

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor (4131) Power Discrete

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor (4131) Power Discrete

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach

Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC300-1

Key Requirements For Attaching Die

  • Thermally conductive. Electrically insulating die attach
  • Superior Reliability
  • Low outgassing
  • Excellent moisture resistance
ATROX NC300-1

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor (4131) Power Discrete

ATROX die attach paste and ATROX die attach film products

ATROX die attach paste and ATROX die attach film products offer excellent reliability and high throughput for various packages.

Leadframe Packaging Laminate Packaging Power Semiconductor (4131) Power Discrete

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach

ATROX, ALPHA Argomax, ALPHA TrueHeight Preforms, Die/Clip attach solutions provide high reliability solutions for demanding power packaging needs.

Various technologies for die and clip attach are provided for unique solutions which address high thermal and demanding reliability applications.

Die Attach
What do you need solved?
Let our experts find your solution.
Contact Us