Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
- Very high thermal conductivity > 130 W/m-K
- Moderate stress material for small to mid size die packages.
- Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu).
Thermosetting Conductive Die Attach Adhesive
ATROX 800HT2V is a thermosetting conductive die attach adhesive with very high thermal conductivity designed for high power semiconductor packages.
ATROX 800HT2V has low resin bleed out and low condensable organics which ensure excellent package reliability.
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