Conductive Die Attach Products

ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.

 

Features

  • Very high thermal conductivity > 130 W/m-K
  • Moderate stress material for small to mid size die packages.
  • Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu).
Technical Data Sheet
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TDS-icon

ATROX 800HT2V Die Attach TDS English

Product Flyer
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ATROX Power Package Die Attach Product Flyer English

Thermosetting Conductive Die Attach Adhesive

ATROX 800HT2V is a thermosetting conductive die attach adhesive with very high thermal conductivity designed for high power semiconductor packages. 


ATROX 800HT2V has low resin bleed out and low condensable organics which ensure excellent package reliability.
 

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ATROX-DIE-ATTACH

ATROX 800HT2V

Product Name Die Attach Format DA Functional Property Die Attach Technology
ATROX 800HT2V Paste Conductive Polymer
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