Product Overview

STAYSTIK 581 is designed for use in a variety of electronic applications, and exhibits excellent bonding properties. STAYSTIK 581 film can be used for substrate attach in hybrid or multi-chip modulus (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features
  • Meets MIL STD 883 requirements
  • Extremely low outgassing
  • Fast bonding to a variety of substrates

Silver Filled Electrically Conductive Film.

STAYSTIK 581
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TDS-icon
TDS

STAYSTIK 581

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 581

Conductive

Film Preforms

Electrically Conductive

Structural Bonding
Reworkable
Wafer Coating

Lamination
Pressure Bonding
Pick & Place

Silver

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