Product Overview

STAYSTIK 571 is designed for use in a variety of electronic applications. STAYSTIK 571 exhibits excellent bonding at low process temperatures and has an extremely low elastic modulus (60,000psi). The compliancy of the adhesive allows for the bonding of two materials with large dissimilarities in thermal expansion coefficients (CTEs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives.

Features
  • Fast bonding to a variety of substrates
  • Easily reworkable material
     

Silver Filled Electrically Conductive Film.

STAYSTIK 571
Image
TDS-icon
TDS

STAYSTIK 571

Product Name

Adhesive Type

Adhesive Format

Adhesive Technology

Adhesive Application

Deposition Method

Silver

STAYSTIK 571

Conductive

Film Preforms

Electrically Conductive

Structural Bonding
Reworkable
Wafer Coating

Lamination
Pressure Bonding
Pick & Place

Silver

What do you need solved?
Let our experts find your solution.