Conductive Die Attach Products

ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.

Features

  • ATROX CF200-1D is a conductive film adhesive with high electrical and thermal conductive properties. 
  • The unique chemistry allows excellent process flexibility and superior reliability performance to a variety of die sizes used for semiconductor applications.
Technical Data Sheet
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TDS-icon

ATROX CF200-1D Adhesive Technical Data Sheet English

Technical Paper
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 Documentation icon - Technical Publication

Chip Scale 2021 QFN Packaging Die Attach Technical Paper English

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ATROX-DIE-ATTACH

High Thermal Conductive Die Attach Film

ATROX CF200-1D is a conductive film adhesive with high electrical and thermal conductive properties. The unique chemistry allows excellent process flexibility and superior reliability performance for a variety of die sizes used for semiconductor applications.

The film has excellent adhesion to silicon wafers as well metallized dies and commonly used leadframe surface finishes such as bare Cu, Ag and NiPdAu.

ATROX CF200-1D

Product Name

Die Attach Format

DA Functional Property

Die Attach Technology

ATROX CF200-1D

Film

Conductive

Polymer

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