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High Thermal Conductivity Die Attach Film
ATROX CF200-1D high thermal and electrical conductivity film is designed for die attach assembly of semiconductor packages. The film offers excellent bond-ability to a variety of leadframe surfaces and die sizes with no resin bleed out (RBO). The bondline thickness is controlled accurately with no die tilting issues resulting in high yield assembly. The low outgassing property of the film ensures superior reliability and Moisture Sensitivity Level (MSL) performance.
Hybrid Silver Sintering Die Attach
The ATROX 800HT Series is a thermosetting conductive die attach adhesive with high thermal conductivity (>100 W/m-K) designed for high power semiconductors and exposed pad semiconductor packages. It has excellent adhesive strength to NiPdAu, Ag and MEP leadframes, low out gassing, which minimizes oven contamination, and is ideal for excellent MSL performance.
Sintered Die Attach
Advanced sinter and solder solutions addressing a wide variety of challenges for power electronics. Our engineered sinter materials are proven to enable high throughput and reliability while providing flexible and easy-to-use form factors that reduce the capital cost and accelerate time to market.
View Products in Die Attach
- ALPHA® Argomax® 2040 Paste
Sinter Silver Paste for Die Attachment (Print and Dispense) with Wet Die Placement
- Applications: Die Attach, Die Top Attach
- Formulated for printing or dot dispense on Ag/Au surfaces
- Designed for die placement on wet paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Proven long stencil life
- ALPHA® NCP-1213
High lead, Zero-halogen, No clean Solder Paste
- Excellent voiding performance on die attach applications
- Excellent dispensing consistency
- High reliability die attach connection for high power semiconductor applications
- ATROX® NC300-1
ATROX Brand of die attach pastes are designed to provide you with superior performance for todays stringent reliability requirements. The die attach products (ATROX) offer complete solution with lower total cost of ownership ushering a new era of high performance materials.
- Electrically insulating High Reliability die attach
- Moderate stress for all die sizes
- Robust adhesion on metal and non-metal surfaces: Ag, Cu, PPF, Au, Si, substrate, etc.
- Excellent ㅇispensability for high throughput
- ATROX® NC200-3
ATROX Brand of die attach pastes are designed to provide you with superior performance for todays stringent reliability requirements. The die attach products (ATROX) offer complete solution with lower total cost of ownership ushering a new era of high performance materials.
- Low stress material for excellent reliability
- Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu) and soldermask
- Compatible with Bare Si and metalized die surfaces
- ALPHA® Argomax® 2010C Paste
Sinter Silver Sintering Paste for Die Attachment
- Applications: Die Attach, Die Top Attach
- Formulated for printing on Ag/Au surfaces
- Designed for die placement on dried paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Proven long stencil life
- ALPHA® Argomax® 8035 Film
Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach
- Designed specifically for wafer dicing after lamination with dicing tape
- Formulated for Cu surface die attach
- Film can be cut to custom sizes
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
- ALPHA® TrueHeight® Solder Preforms
ALPHA TrueHeight Preforms are solder preforms designed to deliver consistent bondline thickness (BLT) and minimize die tilt resulting in predictable reliability and performance.
- BLT control of 0.075mm and higher standard.
- Prevents bondline tilt.
- Various preform sizes, shapes and thicknesses available.
- Preforms available in all standard solder and 4N purity alloys.
- External flux coatings available for traditional and low voiding applications using non-tacky flux formulations.
- ATROX® 590-4HT1
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
- Low stress thermosetting conductive die attach adhesive.
- Low out gassing which minimizes oven contamination and is ideal for excellent MSL performance.
- Excellent adhesive strength to Cu, NiPdAu leadframes and solder-mask surfaces.
- ATROX® HT900-6B
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- High thermal conductivity > 90 W/m-K
- Ultra-low stress material for larger size die packages (> 50mm2).
- Compatible with multiple leadframe surfaces: Ag, Cu & PPF (NiPdAu).
- ATROX® HT900-3
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
- Good thermal conductivity > 20 W/m-K
- Low stress material for small to medium size die packages (< 25mm2).
- Low RBO and compatible with multiple leadframe surfaces: Cu & PPF (NiPdAu).
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