TDS

A printable thermosetting conductive die attach adhesive with very high thermal conductivity designed for high-power semiconductor packages.

Ultra Low Stress Thermosetting Conductive Die Attach Adhesive with High Thermal Conductivity

Low stress thermosetting conductive die attached adhesive with high thermal conductivity

An ultra-low stress thermosetting conductive die attach adhesive with high thermal conductivity designed for high power exposed pad semiconductors.

Thermosetting Conductive Die Attach Adhesive with High Thermal Conductivity

Thermosetting Conductive Die Attach Adhesive with High Thermal Conductivity

Thermosetting Conductive Die Attach Adhesive with Extremely High Thermal Conductivity

Conductive Film Adhesive

Conductive Film Adhesive

Thermosetting Conductive Die Attach Adhesive

Low Stress Thermosetting Conductive Die attach Adhesive with High Thermal Conductivity