961 results
Systek™ BAF Ni
Next-generation boric acid-free nickel barrier technology enables excellent coplanarity for high performance packages.
Learn moreMacuSpec™ VF-TH Series
Copper plating baths that can simultaneously fill copper microvias and plate through holes with aspect ratios of up to 8:1.
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MultiPrep 200
Adhesion promoter that enables superior bonding for solder mask, dry film, and liquid photoresist on copper.
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Pulse plating process with excellent control of throwing power within through-holes, surface copper thickness and variation.
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MacuSpec™ HT 360
State-of-the-art DC acid copper plating process that enables high-throw, high-volume production with no need for pulse plating.
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DC acid copper pattern plating process specifically designed for consistent void-free filling of vias for 2-in-1 RDL applications.
Learn moreAffinity™ ENEPIG
Electroless-nickel electroless-palladium immersion-gold surface finish provides a foundation for strong wire bonding on IC substrates.
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Affinity™ ENEPIG
Simple-to-operate process providing uniform nickel, palladium, and gold deposits with high reliability at the lowest cost of ownership.
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Systek™ HCP 100
High-speed acid copper plating process provides exceptional uniformity for mega pillar applications.
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Extremely stable immersion tin process with exceptional solderability, even after multiple lead-free assembly reflows.
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